Inventor · disambiguated record
Kenta Uchiyama
Also filed as: UCHIYAMA KENTA
10 granted patents·1 pending application·90 citations·filing 2009–2016
88Inventor score
Top patents by PatentIndex Score
11 records- 0193US8174109B2Electronic device and method of manufacturing sameUCHIYAMA KENTA·Filed 2010·Granted May 8, 2012·28 cites·11 claims
- 0290US8786103B2Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layerUCHIYAMA KENTA·Filed 2010·Granted Jul 22, 2014·13 cites·8 claims
- 0388US9041211B2Semiconductor package and method for manufacturing the semiconductor package embedded with semiconductor chipUCHIYAMA KENTA·Filed 2012·Granted May 26, 2015·11 cites·9 claims
- 0485US8450853B2Semiconductor device and a method of manufacturing the same, and an electronic deviceUCHIYAMA KENTA·Filed 2010·Granted May 28, 2013·10 cites·11 claims
- 0585US8169072B2Semiconductor device, manufacturing method thereof, and electronic deviceUCHIYAMA KENTA·Filed 2010·Granted May 1, 2012·9 cites·6 claims
- 0683US9515050B2Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor componentsSHINKO ELECTRIC IND CO·Filed 2014·Granted Dec 6, 2016·6 cites·10 claims
- 0780US8692363B2Electric part package and manufacturing method thereofKOIZUMI NAOYUKI·Filed 2011·Granted Apr 8, 2014·6 cites·7 claims
- 0879US9136220B2Semiconductor package and method for manufacturing the semiconductor packageUCHIYAMA KENTA·Filed 2012·Granted Sep 15, 2015·5 cites·5 claims
- 0971US9899304B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Feb 20, 2018·2 cites·12 claims
- 1054US8314347B2Wiring board with lead pins and method of producing the sameUCHIYAMA KENTA·Filed 2009·Granted Nov 20, 2012·0 cites·13 claims
- 1138US2012119391A1Semiconductor package and manufacturing method thereofKOIZUMI NAOYUKI·Filed 2011·Application pending·0 cites
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