Inventor · disambiguated record
Seonghwan Park
Also filed as: PARK SEONGHWAN
11 granted patents·7 pending applications·45 citations·filing 2011–2024
87Inventor score
Files withDONGWOO FINE CHEM CO LTD5JCET STATS CHIPPAC KOREA LTD4STATS CHIPPAC PTE LTD4SAMSUNG ELECTRONICS CO LTD2DONGWOOD FINE CHEM CO LTD1
Top patents by PatentIndex Score
18 records- 0198US11610847B2Laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2021·Granted Mar 21, 2023·7 cites·22 claims
- 0297US11862572B2Laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 2, 2024·4 cites·25 claims
- 0394US9368647B2Compositions for etchingSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 14, 2016·15 cites·20 claims
- 0487US8940182B2Compositions for etching and methods of forming a semiconductor device using the sameHONG YOUNG-TAEK·Filed 2012·Granted Jan 27, 2015·12 cites·16 claims
- 0582US12394727B2Semiconductor device and method for forming electromagnetic interference (EMI) shielded packages with laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Aug 19, 2025·0 cites·24 claims
- 0677US9136120B2Compositions for etching and methods of forming a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 15, 2015·3 cites·8 claims
- 0766US8129322B2Photosensitive-resin remover composition and method of fabricating semiconductor device using the sameLEE AHN-HO·Filed 2011·Granted Mar 6, 2012·3 cites·3 claims
- 0864US11216131B2Film touch sensor and manufacturing method thereforDONGWOO FINE CHEM CO LTD·Filed 2015·Granted Jan 4, 2022·1 cites·23 claims
- 0963US11609668B2Film touch sensor and manufacturing method thereforDONGWOO FINE CHEM CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·31 claims
- 1057US2025125281A1Semiconductor package assembly and methods for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1156US10705659B2Film touch sensor and method of preparing the sameDONGWOO FINE CHEM CO LTD·Filed 2015·Granted Jul 7, 2020·0 cites·35 claims
- 1255US2023411305A1Method for selectively forming a shielding layer on a semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1354US2024355643A1Semiconductor device with a partial shielding layer and a method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1453US2022066582A1Film touch sensor and manufacturing method thereforDONGWOOD FINE CHEM CO LTD·Filed 2020·Application pending·0 cites
- 1552US2024120268A1Method for forming a shielding layer on a semiconductor deviceJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 1652US2024105638A1Semiconductor device and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 1751US11094756B2OLED integrated digitizer and method of preparing the sameDONGWOO FINE CHEM CO LTD·Filed 2019·Granted Aug 17, 2021·0 cites·15 claims
- 1840US2019278399A1Input sensor and display device including the sameDONGWOO FINE CHEM CO LTD·Filed 2019·Application pending·0 cites
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