Inventor · disambiguated record
Yuh Chern Shieh
Also filed as: SHIEH YUH CHERN
8 granted patents·61 citations·filing 2011–2016
81Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3SHIEH YUH CHERN2CHANG KUO-CHIN1CHEN YU-FENG1LIN TSUNG-SHU1
Top patents by PatentIndex Score
8 records- 0195US8288871B1Reduced-stress bump-on-trace (BOT) structuresSHIEH YUH CHERN·Filed 2011·Granted Oct 16, 2012·53 cites·20 claims
- 0283US8970033B2Extending metal traces in bump-on-trace structuresCHEN YU-FENG·Filed 2011·Granted Mar 3, 2015·7 cites·17 claims
- 0359US8519535B2Method and structure for controlling package warpageLIN TSUNG-SHU·Filed 2011·Granted Aug 27, 2013·1 cites·13 claims
- 0453US10157831B2Semiconductor device having a conductive via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·0 cites·20 claims
- 0552US9406634B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 2, 2016·0 cites·20 claims
- 0652US9041223B2Bump-on-trace (BOT) structuresSHIEH YUH CHERN·Filed 2012·Granted May 26, 2015·0 cites·13 claims
- 0751US9514978B2Method of forming semiconductor device having a conductive via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 6, 2016·0 cites·20 claims
- 0843US9159638B2Conductive via structureCHANG KUO-CHIN·Filed 2011·Granted Oct 13, 2015·0 cites·14 claims
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