Inventor · disambiguated record
Arjang Fartash
Also filed as: FARTASH ARJANG
22 granted patents·1 pending application·333 citations·filing 2001–2009
95Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO11INTEL CORP9FARTASH ARJANG1MARDILOVICH PETER1TRUNINGER MARTHA A1
Top patents by PatentIndex Score
23 records- 0195US6790775B2Method of forming a through-substrate interconnectHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Sep 14, 2004·124 cites·52 claims
- 0291US6501658B2Heatsink mounting with shock absorbersINTEL CORP·Filed 2001·Granted Dec 31, 2002·75 cites·17 claims
- 0384US6942318B2Chamber having a protective layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Sep 13, 2005·22 cites·26 claims
- 0480US7517060B2Fluid-ejection devices and a deposition method for layers thereofHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Apr 14, 2009·5 cites·15 claims
- 0580US7025894B2Fluid-ejection devices and a deposition method for layers thereofHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Apr 11, 2006·18 cites·7 claims
- 0677US7552533B2Method of manufacturing a fluid ejector headHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jun 30, 2009·4 cites·7 claims
- 0772US7081306B2Compressive alpha-tantalum thin film stackHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jul 25, 2006·3 cites·17 claims
- 0870US6700800B2Retainer for circuit board assembly and method for using the sameINTEL CORP·Filed 2002·Granted Mar 2, 2004·15 cites·9 claims
- 0970US6472612B2Printed circuit board with embedded thermocouple junctionsINTEL CORP·Filed 2001·Granted Oct 29, 2002·17 cites·25 claims
- 1067US6875931B2Retainer for circuit board assembly and method for using the sameINTEL CORP·Filed 2002·Granted Apr 5, 2005·14 cites·21 claims
- 1162US8390423B2Nanoflat resistorFARTASH ARJANG·Filed 2009·Granted Mar 5, 2013·2 cites·20 claims
- 1261US6955835B2Method for forming compressive alpha-tantalum on substrates and devices including the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Oct 18, 2005·6 cites·21 claims
- 1360US8388112B2Printhead and method of fabricating the sameMARDILOVICH PETER·Filed 2009·Granted Mar 5, 2013·1 cites·13 claims
- 1460US7132132B2Method of forming a fluid ejection device with a compressive alpha-tantalum layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Nov 7, 2006·1 cites·2 claims
- 1559US6926390B2Method of forming mixed-phase compressive tantalum thin films using nitrogen residual gas, thin films and fluid ejection devices including sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Aug 9, 2005·3 cites·23 claims
- 1655US6791189B2Epoxy washer for retention of inverted SMT componentsINTEL CORP·Filed 2002·Granted Sep 14, 2004·5 cites·18 claims
- 1755US6691407B2Methods for retaining assembled componentsINTEL CORP·Filed 2001·Granted Feb 17, 2004·5 cites·14 claims
- 1853US7131193B2Heat-shrinkable retainer for PCB double-sided assemblyINTEL CORP·Filed 2004·Granted Nov 7, 2006·3 cites·16 claims
- 1952US7445810B2Method of making a tantalum layer and apparatus using a tantalum layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Nov 4, 2008·3 cites·56 claims
- 2049US6906268B2Heat-shrinkable retainer for PCB double-sided assemblyINTEL CORP·Filed 2001·Granted Jun 14, 2005·2 cites·26 claims
- 2145US6552275B2Surface mount componentINTEL CORP·Filed 2001·Granted Apr 22, 2003·4 cites·20 claims
- 2241US6893116B2Fluid ejection device with compressive alpha-tantalum layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted May 17, 2005·1 cites·19 claims
- 2340US2007097476A1Display system having a charge-controlled spatial light-modulatorTRUNINGER MARTHA A·Filed 2005·Application pending·0 cites
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