Inventor · disambiguated record
Kyong-Nam Kim
Also filed as: KIM KYONG-NAM
7 granted patents·4 pending applications·80 citations·filing 2002–2023
81Inventor score
Files withDAEJEON UNIV INDUSTRY UNIV COOPERATION FOUNDATION2UNIV SUNGKYUNKWAN2YEOM GEUN YOUNG2LG ELECTRONICS INC1ORIOL INC1
Top patents by PatentIndex Score
11 records- 0190US6818532B2Method of etching substratesORIOL INC·Filed 2002·Granted Nov 16, 2004·50 cites·47 claims
- 0281US7012012B2Method of etching substratesLG ELECTRONICS INC·Filed 2004·Granted Mar 14, 2006·22 cites·20 claims
- 0375US7842159B2Inductively coupled plasma processing apparatus for very large area using dual frequencyUNIV SUNGKYUNKWAN FOUND·Filed 2006·Granted Nov 30, 2010·4 cites·3 claims
- 0456US7338577B2Inductively coupled plasma processing apparatus having internal linear antenna for large area processingSUNGKYUKWAN UNIVERSITY·Filed 2003·Granted Mar 4, 2008·4 cites·7 claims
- 0547US2023395386A1Etching processing apparatus and etching processing methodDAEJEON UNIV INDUSTRY UNIV COOPERATION FOUNDATION·Filed 2023·Application pending·0 cites
- 0646US8974630B2Inductively coupled plasma processing apparatus having internal linear antenna for large area processingYEOM GEUN-YOUNG·Filed 2008·Granted Mar 10, 2015·0 cites·8 claims
- 0746US8293069B2Inductively coupled plasma apparatusYEOM GEUN-YOUNG·Filed 2008·Granted Oct 23, 2012·0 cites·6 claims
- 0845US12482639B2Method and system for removing L-FC in plasma etching processDAEJEON UNIV INDUSTRY UNIV COOPERATION FOUNDATION·Filed 2020·Granted Nov 25, 2025·0 cites·4 claims
- 0939US2005199186A1Inductively coupled plasma apparatus using magnetic fieldUNIV SUNGKYUNKWAN·Filed 2004·Application pending·0 cites
- 1037US2004060662A1Inductively coupled plasma processing apparatus having internal linear antenna for large area processingUNIV SUNGKYUNKWAN·Filed 2003·Application pending·0 cites
- 1135US2017316949A1Method of etching atomic layerUNIV SUNGKYUNKWAN RES & BUS·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →