Inventor · disambiguated record
Youngho Rho
Also filed as: RHO YOUNGHO
12 granted patents·2 pending applications·5 citations·filing 2020–2024
82Inventor score
Files withABSOLICS INC14
Top patents by PatentIndex Score
14 records- 0193US11437308B2Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatusABSOLICS INC·Filed 2021·Granted Sep 6, 2022·3 cites·14 claims
- 0286US12456653B2Packaging substrate and semiconductor device comprising the sameABSOLICS INC·Filed 2022·Granted Oct 28, 2025·1 cites·8 claims
- 0378US12027454B1Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the sameABSOLICS INC·Filed 2023·Granted Jul 2, 2024·0 cites·10 claims
- 0477US12198994B2Packaging substrate and method for manufacturing sameABSOLICS INC·Filed 2020·Granted Jan 14, 2025·1 cites·9 claims
- 0575US11728259B2Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the sameABSOLICS INC·Filed 2022·Granted Aug 15, 2023·0 cites·10 claims
- 0674US2025096055A1Packaging substrate and method for manufacturing sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 0771US11469167B2Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the sameABSOLICS INC·Filed 2021·Granted Oct 11, 2022·0 cites·10 claims
- 0870US12288742B2Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2023·Granted Apr 29, 2025·0 cites·5 claims
- 0967US12456672B2Packaging substrate having element group in cavity unit and semiconductor device comprising the sameABSOLICS INC·Filed 2023·Granted Oct 28, 2025·0 cites·12 claims
- 1057US11652039B2Packaging substrate with core layer and cavity structure and semiconductor device comprising the sameABSOLICS INC·Filed 2020·Granted May 16, 2023·0 cites·9 claims
- 1156US2022165650A1Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2020·Application pending·0 cites
- 1250US12165979B2Packaging substrate and semiconductor apparatus comprising sameABSOLICS INC·Filed 2021·Granted Dec 10, 2024·0 cites·10 claims
- 1349US11981501B2Loading cassette for substrate including glass and substrate loading method to which same is appliedABSOLICS INC·Filed 2020·Granted May 14, 2024·0 cites·10 claims
- 1447US11967542B2Packaging substrate, and semiconductor device comprising sameABSOLICS INC·Filed 2020·Granted Apr 23, 2024·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →