Inventor · disambiguated record
Chieh-Yen Chen
Also filed as: CHEN CHIEH-YEN
37 granted patents·24 pending applications·79 citations·filing 2016–2025
96Inventor score
Top patents by PatentIndex Score
61 records- 0198US11769731B2Architecture for computing system packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·4 cites·20 claims
- 0297US12327796B2Architecture for computing system packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 10, 2025·2 cites·20 claims
- 0397US11387222B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·5 cites·20 claims
- 0497US10777518B1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·19 cites·20 claims
- 0596US11948926B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 2, 2024·2 cites·20 claims
- 0694US12125798B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 22, 2024·2 cites·20 claims
- 0793US11527486B2Semiconductor device with shield for electromagnetic interferenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·2 cites·20 claims
- 0893US10672728B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·6 cites·20 claims
- 0993US10510679B2Semiconductor device with shield for electromagnetic interferenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·7 cites·20 claims
- 1091US9818722B1Package structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·7 cites·20 claims
- 1190US12417991B2Chip stack structure with conductive plug and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·1 cites·20 claims
- 1290US11348886B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 1389US11621244B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 4, 2023·4 cites·20 claims
- 1488US12191270B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·1 cites·20 claims
- 1588US11532533B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 1688US10867936B2Semiconductor device with shield for electromagnetic interferenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 1785US12334457B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 1884US2025266363A1Architecture for computing system packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1983US12315854B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 2083US12051649B2Architecture for computing system packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 2182US10304614B2Stacked coil for wireless charging structure on InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 28, 2019·2 cites·20 claims
- 2281US10847304B2InFO coil on metal plate with slotTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·2 cites·20 claims
- 2381US2025357457A1Three dimensional (3d) chiplet and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2480US12068295B2Deep partition power delivery with deep trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 2579US12057407B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 2679US11244896B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·2 cites·20 claims
- 2779US2024379619A1Integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2879US2024355799A1Deep partition power delivery with deep trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2979US2024355755A1Semiconductor Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3079US2025259976A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3178US11929333B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·20 claims
- 3277US2025300032A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3377US2025062188A1Semiconductor packages and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3477US2025355171A1Integrated Memory Device with Optical LinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3577US2025087608A1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3675US12278214B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 3775US10510682B2Semiconductor device with shield for electromagnetic interferenceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·17 claims
- 3874US11335767B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 17, 2022·2 cites·20 claims
- 3974US2025323198A1Chip stack structure with conductive plug and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4073US12412799B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 4173US2025329701A1Semiconductor package structure with interposer diesTAIWAN SEMICONDUCTOR MANUFACTURIING CO LTD·Filed 2025·Application pending·0 cites
- 4272US12165952B2Interposer directly bonded to bonding pads on a plurality of diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 4371US11784172B2Deep partition power delivery with deep trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·0 cites·19 claims
- 4471US10163854B2Package structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·1 cites·20 claims
- 4571US2025239579A1Semiconductor package structure with interposer diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4671US2025244527A1Integrated Memory Device with Optical LinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4770US11600431B2InFO coil on metal plate with slotTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 4866US2023420437A1Three dimensional (3d) chiplet and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4965US10825602B2Stacked coil for wireless charging structure on InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 5063US10510478B2Stacked coil for wireless charging structure on InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·0 cites·20 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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