Inventor · disambiguated record
Akimori Hayashi
Also filed as: HAYASHI AKIMORI
4 granted patents·2 pending applications·53 citations·filing 2005–2022
73Inventor score
Top patents by PatentIndex Score
6 records- 0191US7378745B2Package substrate for a semiconductor device having thermoplastic resin layers and conductive patternsNEC ELECTRONICS CORP·Filed 2005·Granted May 27, 2008·39 cites·21 claims
- 0274US7323238B2Printed circuit board having colored outer layerDENSO CORP·Filed 2005·Granted Jan 29, 2008·7 cites·14 claims
- 0371US7728444B2Wiring boardNEC ELECTRONICS CORP·Filed 2008·Granted Jun 1, 2010·7 cites·11 claims
- 0448US2010007005A1Semiconductor deviceNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 0545US12475570B2Generating Trimap from distance information using an image plane phase detection sensorCANON KK·Filed 2022·Granted Nov 18, 2025·0 cites·22 claims
- 0643US2012261840A1Semiconductor deviceAKIMOTO TETSUYA·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →