Inventor · disambiguated record
Tadashi Murai
Also filed as: MURAI TADASHI
2 granted patents·46 citations·filing 2005–2005
62Inventor score
Technology areasH05K
Top patents by PatentIndex Score
2 records- 0191US7378745B2Package substrate for a semiconductor device having thermoplastic resin layers and conductive patternsNEC ELECTRONICS CORP·Filed 2005·Granted May 27, 2008·39 cites·21 claims
- 0274US7323238B2Printed circuit board having colored outer layerDENSO CORP·Filed 2005·Granted Jan 29, 2008·7 cites·14 claims
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