Inventor · disambiguated record
Meng Kong Lye
Also filed as: LYE MENG KONG
29 granted patents·3 pending applications·62 citations·filing 2010–2022
94Inventor score
Top patents by PatentIndex Score
32 records- 0193US9355945B1Semiconductor device with heat-dissipating lead frameFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 31, 2016·12 cites·10 claims
- 0289US9548255B1IC package having non-horizontal die pad and flexible substrate thereforFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Jan 17, 2017·7 cites·19 claims
- 0389US9379035B1IC package having non-horizontal die pad and lead frame thereforFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 28, 2016·7 cites·19 claims
- 0487US10515880B2Lead frame with bendable leadsNXP USA INC·Filed 2019·Granted Dec 24, 2019·5 cites·20 claims
- 0586US11515238B2Power die packageNXP USA INC·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 0684US10041195B2Woven signal-routing substrate for wearable electronic devicesFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Aug 7, 2018·3 cites·17 claims
- 0780US9337140B1Signal bond wire shieldFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 10, 2016·4 cites·8 claims
- 0876US9484289B2Semiconductor device with heat spreaderGE YOU·Filed 2014·Granted Nov 1, 2016·5 cites·12 claims
- 0976US8901722B2Semiconductor device with integral heat sinkGE YOU·Filed 2013·Granted Dec 2, 2014·5 cites·19 claims
- 1073US9449901B1Lead frame with deflecting tie bar for IC packageFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Sep 20, 2016·2 cites·13 claims
- 1171US10787361B2Sensor device with flip-chip die and interposerNXP USA INC·Filed 2018·Granted Sep 29, 2020·2 cites·14 claims
- 1270US10181434B1Lead frame for integrated circuit device having J-leads and gull wing leadsNXP USA INC·Filed 2018·Granted Jan 15, 2019·1 cites·16 claims
- 1368US9190343B1Semiconductor device with tube based heat spreaderGE YOU·Filed 2014·Granted Nov 17, 2015·2 cites·18 claims
- 1462US11456188B2Method of making flexible semiconductor device with graphene tapeNXP USA INC·Filed 2020·Granted Sep 27, 2022·0 cites·20 claims
- 1559US9196576B2Semiconductor package with stress relief and heat spreaderYOW KAI YUN·Filed 2014·Granted Nov 24, 2015·1 cites·7 claims
- 1659US8242613B2Bond pad for semiconductor dieVERMA CHETAN·Filed 2010·Granted Aug 14, 2012·1 cites·16 claims
- 1755US9147656B1Semiconductor device with improved shieldingVARSHNEY SUMIT·Filed 2014·Granted Sep 29, 2015·1 cites·13 claims
- 1855US2023110402A1Semiconductor device and method for packagingNXP USA INC·Filed 2022·Application pending·0 cites
- 1955US2023115182A1Semiconductor device qfn package and method of making thereofNXP USA INC·Filed 2022·Application pending·0 cites
- 2053US12051642B2QFN semiconductor package, semiconductor package and lead frameNXP USA INC·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 2151US11171077B2Semiconductor device with lead frame that accommodates various die sizesNXP USA INC·Filed 2020·Granted Nov 9, 2021·0 cites·14 claims
- 2251US10692802B2Flexible semiconductor device with graphene tapeNXP USA INC·Filed 2016·Granted Jun 23, 2020·0 cites·10 claims
- 2351US9196578B1Common pin for multi-die semiconductor packageLIM SHEAU MEI·Filed 2014·Granted Nov 24, 2015·2 cites·4 claims
- 2446US10734311B2Hybrid lead frame for semiconductor die package with improved creepage distanceNXP USA INC·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 2543US10217700B1Lead frame for integrated circuit device having J-leads and Gull Wing leadsNXP USA INC·Filed 2018·Granted Feb 26, 2019·0 cites·13 claims
- 2643US9177834B2Power bar design for lead frame-based packagesFOONG CHEE SENG·Filed 2014·Granted Nov 3, 2015·0 cites·8 claims
- 2743US9165869B1Semiconductor device with twisted leadsCHEE SOO CHOONG·Filed 2014·Granted Oct 20, 2015·0 cites·12 claims
- 2841US10217697B2Semiconductor device and lead frame with high density lead arrayNXP USA INC·Filed 2016·Granted Feb 26, 2019·0 cites·9 claims
- 2940US8980690B1Lead frame based semiconductor device with routing substrateMEI PENGLIN·Filed 2014·Granted Mar 17, 2015·0 cites·20 claims
- 3038US9633959B2Integrated circuit die with corner IO padsKUMAR SHAILESH·Filed 2015·Granted Apr 25, 2017·0 cites·11 claims
- 3136US8291368B2Method for reducing surface area of pad limited semiconductor die layoutVERMA CHETAN·Filed 2011·Granted Oct 16, 2012·0 cites·20 claims
- 3231US2011204498A1Lead frame and semiconductor package manufactured therewithFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
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