Inventor · disambiguated record
Tatsuyuki Saito
Also filed as: SAITO TATSUYUKI
62 granted patents·9 pending applications·654 citations·filing 2000–2019
99Inventor score
Files withRENESAS TECH CORP19RENESAS ELECTRONICS CORP11HITACHI LTD9HITACHI INT ELECTRIC INC7SAITO TATSUYUKI7
Top patents by PatentIndex Score
71 records- 0196US6731007B1Semiconductor integrated circuit device with vertically stacked conductor interconnectionsHITACHI LTD·Filed 2000·Granted May 4, 2004·85 cites·50 claims
- 0293US9064870B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 23, 2015·7 cites·15 claims
- 0392US6818546B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Nov 16, 2004·50 cites·35 claims
- 0491US8808455B2Substrate processing apparatus and method of manufacturing semiconductor deviceSAITO TATSUYUKI·Filed 2011·Granted Aug 19, 2014·14 cites·8 claims
- 0591US6908847B2Method of manufacturing a semiconductor device having an interconnect embedded in an insulating filmRENESAS TECH CORP·Filed 2002·Granted Jun 21, 2005·46 cites·17 claims
- 0690US7323781B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2004·Granted Jan 29, 2008·30 cites·24 claims
- 0789US9659867B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted May 23, 2017·2 cites·4 claims
- 0889US6838772B2Semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Jan 4, 2005·47 cites·21 claims
- 0989US6764950B2Fabrication method for semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2001·Granted Jul 20, 2004·38 cites·12 claims
- 1088US8617981B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 31, 2013·4 cites·12 claims
- 1188US7387957B2Fabrication process for a semiconductor integrated circuit deviceHITACHI LTD·Filed 2005·Granted Jun 17, 2008·12 cites·3 claims
- 1287US9340873B2Semiconductor device manufacturing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 17, 2016·4 cites·16 claims
- 1387US8431480B2Semiconductor device and manufacturing method thereofNOGUCHI JUNJI·Filed 2011·Granted Apr 30, 2013·4 cites·12 claims
- 1487US7642652B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jan 5, 2010·9 cites·21 claims
- 1586US11162574B2Speed reduction mechanism and motor with speed reducerMITSUBA CORP·Filed 2018·Granted Nov 2, 2021·3 cites·5 claims
- 1686US8384220B2Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 2008·Granted Feb 26, 2013·10 cites·6 claims
- 1785US7232757B2Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Jun 19, 2007·26 cites·20 claims
- 1884US8053893B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 8, 2011·6 cites·14 claims
- 1982US9472398B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 18, 2016·3 cites·6 claims
- 2082USD655255SBoat of wafer processing apparatusTAKEBAYASHI YUJI·Filed 2010·Granted Mar 6, 2012·29 cites·1 claims
- 2181US6716749B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Apr 6, 2004·14 cites·6 claims
- 2280US8866271B2Semiconductor device manufacturing method, substrate processing apparatus and semiconductor deviceYAMAMOTO KATSUHIKO·Filed 2011·Granted Oct 21, 2014·5 cites·9 claims
- 2380US7053487B2Semiconductor deviceRENESASTECHNOLOGY CORP·Filed 2002·Granted May 30, 2006·24 cites·37 claims
- 2480US6861756B2Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 2004·Granted Mar 1, 2005·20 cites·21 claims
- 2579US9238257B2Method of manufacturing semiconductor device, cleaning method, and substrate processing apparatusSAKAI MASANORI·Filed 2010·Granted Jan 19, 2016·4 cites·17 claims
- 2679US8618712B2Electric motor and reduction motorSAITO TATSUYUKI·Filed 2013·Granted Dec 31, 2013·3 cites·15 claims
- 2779USD655682SBoat of wafer processing apparatusTAKEBAYASHI YUJI·Filed 2010·Granted Mar 13, 2012·26 cites·1 claims
- 2878US8691708B2Method of manufacturing semiconductor device and substrate processing apparatusKAGA YUKINAO·Filed 2011·Granted Apr 8, 2014·4 cites·9 claims
- 2978US6426255B1Process for making a semiconductor integrated circuit device having a dynamic random access memoryHITACHI LTD·Filed 2000·Granted Jul 30, 2002·23 cites·38 claims
- 3077US9856943B2Reduction motorMITSUBA CORP·Filed 2013·Granted Jan 2, 2018·7 cites·6 claims
- 3177US8810034B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 19, 2014·1 cites·9 claims
- 3277US6864169B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Mar 8, 2005·12 cites·14 claims
- 3375US10304726B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted May 28, 2019·0 cites·11 claims
- 3475US9045825B2Method of forming metal-containing filmKAGA YUKINAO·Filed 2012·Granted Jun 2, 2015·3 cites·6 claims
- 3575US2019244855A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 3674US8436505B2Electric motor and reduction motorSAITO TATSUYUKI·Filed 2009·Granted May 7, 2013·5 cites·6 claims
- 3774US6849535B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Feb 1, 2005·9 cites·3 claims
- 3873US7777343B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Aug 17, 2010·2 cites·6 claims
- 3973US6797609B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Sep 28, 2004·9 cites·10 claims
- 4072US10121693B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 6, 2018·0 cites·11 claims
- 4172US8857890B2Driving apparatus for opening and closing body for vehicleOKADA MITSUHIRO·Filed 2011·Granted Oct 14, 2014·7 cites·10 claims
- 4272US6756679B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Jun 29, 2004·8 cites·10 claims
- 4371US7321171B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Jan 22, 2008·10 cites·18 claims
- 4470US9818639B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 14, 2017·0 cites·4 claims
- 4570US6764945B2Method of manufacturing a multilayer metallization structure with non-directional sputtering methodRENESAS TECH CORP·Filed 2001·Granted Jul 20, 2004·13 cites·21 claims
- 4666US9490213B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·0 cites·8 claims
- 4766US8941283B2Electric motor and reduction motorSAITO TATSUYUKI·Filed 2013·Granted Jan 27, 2015·1 cites·8 claims
- 4864US9466477B2Method of manufacturing semiconductor device, substrate processing apparatus, and semiconductor deviceSAITO TATSUYUKI·Filed 2010·Granted Oct 11, 2016·1 cites·8 claims
- 4960US7777346B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 17, 2010·1 cites·12 claims
- 5058US6815330B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Nov 9, 2004·3 cites·11 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →