Inventor · disambiguated record
Hiroki Miyajima
Also filed as: MIYAJIMA HIROKI
28 granted patents·4 pending applications·33 citations·filing 2002–2025
93Inventor score
Files withSEIKO EPSON CORP23MIYAJIMA HIROKI3TOKYO ELECTRON LTD2MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1PANASONIC CORP1
Top patents by PatentIndex Score
32 records- 0191US9895884B2Head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Feb 20, 2018·4 cites·8 claims
- 0287US9461019B2Semiconductor device and method for making the devicePANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 4, 2016·6 cites·18 claims
- 0384US9421766B2Flow path member, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Aug 23, 2016·3 cites·17 claims
- 0484US9024390B2Semiconductor devicePANASONIC CORP·Filed 2013·Granted May 5, 2015·7 cites·7 claims
- 0584US8246153B2Bubble control unit, liquid ejecting head, and liquid ejecting apparatusMIYAJIMA HIROKI·Filed 2009·Granted Aug 21, 2012·8 cites·8 claims
- 0676US2025303721A1Method Of Manufacturing Liquid Ejecting HeadSEIKO EPSON CORP·Filed 2025·Application pending·0 cites
- 0776US2025303720A1Method Of Manufacturing Liquid Ejecting Head And Method Of Managing Head ChipSEIKO EPSON CORP·Filed 2025·Application pending·0 cites
- 0875US9073073B2Flow path member, liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2012·Granted Jul 7, 2015·2 cites·20 claims
- 0974US11400817B2Power conversion controllerTOKAI RYOKAKU TETSUDO KK·Filed 2020·Granted Aug 2, 2022·1 cites·3 claims
- 1071US9352596B2Liquid ejecting apparatus with wiring board positioned between transport rollersSEIKO EPSON CORP·Filed 2015·Granted May 31, 2016·1 cites·2 claims
- 1168US12043033B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 1259US9550361B2Liquid ejecting apparatusSEIKO EPSON CORP·Filed 2016·Granted Jan 24, 2017·0 cites·6 claims
- 1357US10981393B2Liquid ejecting apparatus and maintenance method thereofSEIKO EPSON CORP·Filed 2019·Granted Apr 20, 2021·0 cites·13 claims
- 1457US9744780B2Liquid ejecting apparatus with wiring board positioned between transport rollersSEIKO EPSON CORP·Filed 2016·Granted Aug 29, 2017·0 cites·7 claims
- 1557US8764166B2Liquid ejecting head and liquid ejecting apparatusMIYAJIMA HIROKI·Filed 2011·Granted Jul 1, 2014·1 cites·3 claims
- 1655US9434168B2Liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Sep 6, 2016·0 cites·7 claims
- 1754US9090071B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2014·Granted Jul 28, 2015·0 cites·4 claims
- 1852US10603915B2Liquid ejecting head and flow passage structureSEIKO EPSON CORP·Filed 2018·Granted Mar 31, 2020·0 cites·20 claims
- 1952US9844941B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Dec 19, 2017·0 cites·14 claims
- 2052US7344652B2Plasma etching methodTOKYO ELECTRON LTD·Filed 2006·Granted Mar 18, 2008·0 cites·20 claims
- 2149US10864736B2Liquid discharge deviceSEIKO EPSON CORP·Filed 2019·Granted Dec 15, 2020·0 cites·8 claims
- 2248US9950526B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Apr 24, 2018·0 cites·14 claims
- 2347US10214020B2Liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Feb 26, 2019·0 cites·6 claims
- 2446US9358799B2Flow path member, ink jet head, and ink jet printerSEIKO EPSON CORP·Filed 2015·Granted Jun 7, 2016·0 cites·17 claims
- 2546US9289992B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Mar 22, 2016·0 cites·11 claims
- 2646US9242465B2Channel structure, liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Jan 26, 2016·0 cites·6 claims
- 2745US9315038B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Apr 19, 2016·0 cites·4 claims
- 2844US9056477B2Backpressure control unit, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2013·Granted Jun 16, 2015·0 cites·6 claims
- 2942US7141178B2Plasma etching methodTOKYO ELECTRON LTD·Filed 2002·Granted Nov 28, 2006·0 cites·2 claims
- 3041US2006157698A1Semiconductor manufacturing system, semiconductor device and method of manufactureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 3139US8256879B2Self-sealing unit, liquid ejecting head unit and liquid ejecting apparatusMIYAJIMA HIROKI·Filed 2010·Granted Sep 4, 2012·0 cites·15 claims
- 3233US2015217570A1Method of manufacturing flow-path structure, method of manufacturing liquid ejecting head, and method of manufacturing liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
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