Inventor · disambiguated record
Richard Hopla
Also filed as: HOPLA RICHARD · HOPLA RICHARD E · HOPLA RICHARD L
10 granted patents·4 pending applications·163 citations·filing 2003–2008
90Inventor score
Top patents by PatentIndex Score
14 records- 0195US6929891B2Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2004·Granted Aug 16, 2005·62 cites·61 claims
- 0287US7132205B2Positive photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2004·Granted Nov 7, 2006·26 cites·43 claims
- 0382US7220520B2Photosensitive resin compositionsFUJIFILM ELECTRONIC MATERIALS·Filed 2006·Granted May 22, 2007·8 cites·18 claims
- 0474US7101652B2Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2004·Granted Sep 5, 2006·13 cites·79 claims
- 0569US7129011B2Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2004·Granted Oct 31, 2006·26 cites·52 claims
- 0666US7399572B2Pretreatment compositionsFUJIFILM ELECTRONIC MATERIALS·Filed 2006·Granted Jul 15, 2008·2 cites·12 claims
- 0763US7416830B2Photosensitive resin compositionsFUJIFILM ELECTRONIC MATERIALS·Filed 2004·Granted Aug 26, 2008·7 cites·46 claims
- 0863US7335319B2Semiconductor stress buffer coating edge bead removal compositions and method for their useARCH SPEC CHEM INC·Filed 2003·Granted Feb 26, 2008·9 cites·1 claims
- 0963US7018776B2Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systemsARCH SPEC CHEM INC·Filed 2003·Granted Mar 28, 2006·7 cites·36 claims
- 1050US7195849B2Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2004·Granted Mar 27, 2007·3 cites·58 claims
- 1150US2008305431A1Pretreatment compositionsPOWELL DAVID B·Filed 2008·Application pending·0 cites
- 1246US2009004444A1Novel Photosensitive Resin CompositionsFUJIFILM ELECTRONIC MATERIALS·Filed 2008·Application pending·0 cites
- 1340US2004224516A1Semiconductor stress buffer coating edge bead removal compositions and method for their useARCH SPEC CHEM INC·Filed 2004·Application pending·0 cites
- 1437US2004161619A1Process for producing a heat resistant relief structureARCH SPEC CHEM INC·Filed 2003·Application pending·0 cites
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