Inventor · disambiguated record
Wen-Ching Tsai
Also filed as: TSAI WEN-CHING
34 granted patents·7 pending applications·278 citations·filing 1995–2025
97Inventor score
Files withAU OPTRONICS CORP16TAIWAN SEMICONDUCTOR MFG CO LTD11UNITED MICROELECTRONICS CORP4CHEN PO-LIN3FUSHENG PREC CO LTD2
Top patents by PatentIndex Score
41 records- 0198US10373885B23D stacked-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 6, 2019·49 cites·20 claims
- 0298US9698081B23D chip-on-wafer-on-substrate structure with via last processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 4, 2017·32 cites·20 claims
- 0396US9666520B23D stacked-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 30, 2017·26 cites·19 claims
- 0495US9449837B23D chip-on-wafer-on-substrate structure with via last processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 20, 2016·13 cites·20 claims
- 0594US9711379B23D stacked-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 18, 2017·12 cites·20 claims
- 0694US9633917B2Three dimensional integrated circuit structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 25, 2017·12 cites·19 claims
- 0792US12292958B2Method for managing passwords for basic input/output system and baseboard management controllerMITAC COMPUTING TECH CORP·Filed 2023·Granted May 6, 2025·2 cites·20 claims
- 0890US10157882B23D chip-on-wafer-on-substrate structure with via last processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·5 cites·20 claims
- 0990US9754918B23D chip-on-wafer-on-substrate structure with via last processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 5, 2017·8 cites·20 claims
- 1087US7544992B2Illuminating efficiency-increasable and light-erasable embedded memory structureUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jun 9, 2009·13 cites·10 claims
- 1186US8212256B2Pixel structure, display panel, eletro-optical apparatus, and method thererofCHEN PO-LIN·Filed 2008·Granted Jul 3, 2012·12 cites·18 claims
- 1286US7247911B2Thin film transistor and manufacturing method thereofAU OPTRONICS CORP·Filed 2005·Granted Jul 24, 2007·13 cites·2 claims
- 1381US7332383B2Switching device for a pixel electrode and methods for fabricating the sameAU OPTRONICS CORP·Filed 2005·Granted Feb 19, 2008·8 cites·10 claims
- 1480US7902670B2Display panel structure and manufacture method thereofAU OPTRONICS CORP·Filed 2007·Granted Mar 8, 2011·8 cites·18 claims
- 1578US7829393B2Copper gate electrode of liquid crystal display device and method of fabricating the sameAU OPTRONICS CORP·Filed 2009·Granted Nov 9, 2010·6 cites·26 claims
- 1677US7625788B2Display element and method of manufacturing the sameAU OPTRONICS CORP·Filed 2008·Granted Dec 1, 2009·6 cites·19 claims
- 1776US7732886B2Pin photodiode structureUNITED MICROELECTRONICS CORP·Filed 2008·Granted Jun 8, 2010·6 cites·9 claims
- 1875US7786514B2Switching device for a pixel electrodeAU OPTRONICS CORP·Filed 2007·Granted Aug 31, 2010·5 cites·12 claims
- 1974US10535631B23D Chip-on-wager-on-substrate structure with via last processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·1 cites·20 claims
- 2073US10971417B23D stacked-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·1 cites·19 claims
- 2171US7417254B2Switching device for a pixel electrode and methods for fabricating the sameAU OPTRONICS CORP·Filed 2006·Granted Aug 26, 2008·4 cites·18 claims
- 2271US7411212B2Switching device for a pixel electrode and methods for fabricating the sameAU OPTRONICS CORP·Filed 2005·Granted Aug 12, 2008·4 cites·5 claims
- 2371US7384831B2Thin film transistor and manufacturing method thereofAU OPTRONICS CORP·Filed 2007·Granted Jun 10, 2008·4 cites·13 claims
- 2463US7528466B2Copper gate electrode of liquid crystal display device and method of fabricating the sameAU OPTRONICS CORP·Filed 2005·Granted May 5, 2009·2 cites·12 claims
- 2562US7639536B2Storage unit of single-conductor non-volatile memory cell and method of erasing the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Dec 29, 2009·2 cites·18 claims
- 2659US8062917B2Display panel structure and manufacture method thereofLIN CHUN-NAN·Filed 2010·Granted Nov 22, 2011·1 cites·10 claims
- 2756US2025315329A1Method of recording error eventMITAC COMPUTING TECH CORP·Filed 2025·Application pending·0 cites
- 2855US8760593B2Thin film transistor and method for manufacturing thereofCHEN PO-LIN·Filed 2008·Granted Jun 24, 2014·1 cites·8 claims
- 2955US5482876AField effect transistor without spacer mask edge defectsUNITED MICROELECTRONICS CORP·Filed 1995·Granted Jan 9, 1996·22 cites·18 claims
- 3053US8232591B2Illuminating efficiency-increasable and light-erasable memorySHIH HUNG-LIN·Filed 2009·Granted Jul 31, 2012·0 cites·10 claims
- 3152US7875885B2Display element and method of manufacturing the sameAU OPTRONICS CORP·Filed 2009·Granted Jan 25, 2011·0 cites·6 claims
- 3251US7888190B2Switching device for a pixel electrode and methods for fabricating the sameAU OPTRONICS CORP·Filed 2008·Granted Feb 15, 2011·0 cites·14 claims
- 3350US2013167978A1Alloy of a Golf ClubFUSHENG PREC CO LTD·Filed 2012·Application pending·0 cites
- 3449US2014241932A1Alloy for Golf Club HeadsFUSHENG PREC CO LTD·Filed 2014·Application pending·0 cites
- 3545US2012261755A1Pixel structure, display panel, electro-optical apparatus, and method thereofCHEN PO-LIN·Filed 2012·Application pending·0 cites
- 3643US2009173944A1Thin film transistor, active device array substrate and liquid crystal display panelAU OPTRONICS CORP·Filed 2008·Application pending·0 cites
- 3739US7598524B2Thin film transistor with electrode adhesion layersAU OPTRONICS CORP·Filed 2005·Granted Oct 6, 2009·0 cites·38 claims
- 3838US2007007630A1Switching element for a pixel electrode and methods for fabricating the sameAU OPTRONICS CORP·Filed 2006·Application pending·0 cites
- 3937US9613926B2Wafer to wafer bonding process and structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·0 cites·20 claims
- 4037US2006141686A1Copper gate electrode of liquid crystal display device and method of fabricating the sameAU OPTRONICS CORP·Filed 2005·Application pending·0 cites
- 4128US8395149B2Semiconductor device structure and method for manufacturing the sameKAO YIH-CHYUN·Filed 2010·Granted Mar 12, 2013·0 cites·20 claims
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