Inventor · disambiguated record
Yung-Li Lu
Also filed as: LU YUNG-LI
10 granted patents·5 pending applications·223 citations·filing 2004–2024
89Inventor score
Top patents by PatentIndex Score
15 records- 0196US7589408B2Stackable semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Sep 15, 2009·59 cites·20 claims
- 0296US7550832B2Stackable semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 23, 2009·56 cites·13 claims
- 0394US7365427B2Stackable semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Apr 29, 2008·43 cites·8 claims
- 0491US7187067B2Sensor chip packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 6, 2007·34 cites·15 claims
- 0569US7122893B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 17, 2006·16 cites·20 claims
- 0668US7547962B2Chip package with a ring having a buffer groove that surrounds the active region of a chipADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 16, 2009·4 cites·6 claims
- 0760US2025309073A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0858US2025167092A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 0957US2025079323A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1053US7049689B2Chip on glass packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 23, 2006·6 cites·24 claims
- 1150US7122757B2Contact sensor package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 17, 2006·5 cites·13 claims
- 1243US7432127B2Chip package and package process thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Oct 7, 2008·0 cites·3 claims
- 1340US2007278696A1Stackable semiconductor packageLU YUNG-LI·Filed 2006·Application pending·0 cites
- 1439US7126221B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 24, 2006·0 cites·7 claims
- 1537US2007075441A1Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
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