Inventor · disambiguated record
Ying-Tsai Yeh
Also filed as: YEH YING-TSAI
4 granted patents·2 pending applications·45 citations·filing 2004–2006
73Inventor score
Top patents by PatentIndex Score
6 records- 0191US7187067B2Sensor chip packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 6, 2007·34 cites·15 claims
- 0253US7049689B2Chip on glass packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 23, 2006·6 cites·24 claims
- 0350US7122757B2Contact sensor package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 17, 2006·5 cites·13 claims
- 0443US7432127B2Chip package and package process thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Oct 7, 2008·0 cites·3 claims
- 0540US2007278696A1Stackable semiconductor packageLU YUNG-LI·Filed 2006·Application pending·0 cites
- 0637US2007252284A1Stackable semiconductor packageSU PO-CHING·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →