Inventor · disambiguated record
Chang-Fu Chen
Also filed as: CHEN CHANG · CHEN CHANG F · CHEN CHANG-FU
15 granted patents·5 pending applications·163 citations·filing 2000–2025
90Inventor score
Files withUNIMICRON TECHNOLOGY CORP8SILICONWARE PRECISION INDUSTRIES CO LTD5CHEN CHANG-FU2SUN SHIH-HAO2JCET GROUP CO LTD1
Top patents by PatentIndex Score
20 records- 0191US6509636B1Semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Jan 21, 2003·84 cites·15 claims
- 0283US6396129B1Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted May 28, 2002·36 cites·7 claims
- 0379US10978401B2Package structureUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Apr 13, 2021·3 cites·8 claims
- 0478US6437447B1Dual-sided chip package without a die padSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 20, 2002·33 cites·12 claims
- 0567US9559045B2Package structure and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Jan 31, 2017·2 cites·10 claims
- 0665US7964106B2Method for fabricating a packaging substrateUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Jun 21, 2011·3 cites·17 claims
- 0764US11476199B2Package structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 18, 2022·0 cites·16 claims
- 0863US2009064456A1Towing Handle AssemblyCHEN CHANG-FU·Filed 2007·Application pending·0 cites
- 0956US2025391741A1Package structure, stacked package structure, and packaging methodJCET GROUP CO LTD·Filed 2025·Application pending·0 cites
- 1050US2024290697A1Power module and manufacturing method and mold thereofSENTEC E&E CO LTD·Filed 2023·Application pending·0 cites
- 1149US11153963B2Circuit carrier structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 19, 2021·0 cites·15 claims
- 1249US8893379B2Manufacturing method of package structureSUN SHIH-HAO·Filed 2012·Granted Nov 25, 2014·0 cites·5 claims
- 1346US8420951B2Package structureSUN SHIH-HAO·Filed 2011·Granted Apr 16, 2013·0 cites·5 claims
- 1443US2007035655A1Multi-functional scanning cameraCHEN CHANG-FU·Filed 2005·Application pending·0 cites
- 1543US2007278659A1Semiconductor package substrate and semiconductor package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 1642US10383226B2Multi-layer circuit structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Aug 13, 2019·0 cites·12 claims
- 1739US9775246B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Sep 26, 2017·0 cites·10 claims
- 1836US10825599B2Carrier structureUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Nov 3, 2020·0 cites·9 claims
- 1935US7135642B2Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrierSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Nov 14, 2006·1 cites·15 claims
- 2026USD577490SSuitcaseZIXTRO INC·Filed 2007·Granted Sep 30, 2008·1 cites·1 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →