Inventor · disambiguated record
Lannie R. Bolde
Also filed as: BOLDE LANNIE R
25 granted patents·1 pending application·582 citations·filing 1991–2020
96Inventor score
Files withIBM26
Top patents by PatentIndex Score
26 records- 0192US6360940B1Method and apparatus for removing known good dieIBM·Filed 2000·Granted Mar 26, 2002·103 cites·14 claims
- 0290US7296725B2Feed devices and methods for injection molded solder systemsIBM·Filed 2006·Granted Nov 20, 2007·12 cites·18 claims
- 0389US6276596B1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2000·Granted Aug 21, 2001·54 cites·20 claims
- 0484US5821161ACast metal seal for semiconductor substrates and process thereofIBM·Filed 1997·Granted Oct 13, 1998·79 cites·21 claims
- 0583US5982038ACast metal seal for semiconductor substratesIBM·Filed 1997·Granted Nov 9, 1999·71 cites·17 claims
- 0681US10930411B2Hybrid cable assembly having shielded and unshielded portionsIBM·Filed 2018·Granted Feb 23, 2021·2 cites·10 claims
- 0777US9108828B2Lift mechanismIBM·Filed 2013·Granted Aug 18, 2015·6 cites·10 claims
- 0875US6153505APlastic solder array using injection molded solderIBM·Filed 1999·Granted Nov 28, 2000·46 cites·8 claims
- 0975US6029882APlastic solder array using injection molded solderIBM·Filed 1998·Granted Feb 29, 2000·38 cites·8 claims
- 1072US6745450B1Method for loading solder balls into a moldIBM·Filed 2000·Granted Jun 8, 2004·13 cites·6 claims
- 1172US5971058AApparatus and method for continuous casting solder onto discrete partsIBM·Filed 1997·Granted Oct 26, 1999·37 cites·8 claims
- 1269US11676741B2Hybrid cable assemblyIBM·Filed 2020·Granted Jun 13, 2023·0 cites·16 claims
- 1368US5170058AApparatus and a method for alignment verification having an opaque work piece between two artwork mastersIBM·Filed 1991·Granted Dec 8, 1992·24 cites·18 claims
- 1465US6888363B1Method and device for cooling/heating die during burn inIBM·Filed 2004·Granted May 3, 2005·11 cites·20 claims
- 1564US6811072B2Known good die removal method and apparatusIBM·Filed 2001·Granted Nov 2, 2004·10 cites·32 claims
- 1663US6182356B1Apparatus for solder ball mold loadingIBM·Filed 1997·Granted Feb 6, 2001·24 cites·13 claims
- 1758US6942137B2Die removal method and apparatusIBM·Filed 2003·Granted Sep 13, 2005·9 cites·12 claims
- 1857US7131565B2Feed devices and methods for injection molded solder systemsIBM·Filed 2003·Granted Nov 7, 2006·5 cites·20 claims
- 1955US6915563B2Apparatus for removing attached dieIBM·Filed 2003·Granted Jul 12, 2005·8 cites·7 claims
- 2053US7806312B2Method and apparatus for removing known good dieIBM·Filed 2006·Granted Oct 5, 2010·0 cites·20 claims
- 2149US6186216B1Cast column grid array extraction apparatus and methodIBM·Filed 1998·Granted Feb 13, 2001·14 cites·24 claims
- 2247US10973157B2Printed circuit card assembly connectable to a server chassisIBM·Filed 2018·Granted Apr 6, 2021·0 cites·14 claims
- 2342US7168609B2Method and apparatus for removing known good dieIBM·Filed 2002·Granted Jan 30, 2007·0 cites·18 claims
- 2439US5913985AFixture and method for securing electronic modules during wet processingIBM·Filed 1997·Granted Jun 22, 1999·8 cites·20 claims
- 2538US2002023945A1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2001·Application pending·0 cites
- 2634US5167078ACompact photo resist dryerIBM·Filed 1991·Granted Dec 1, 1992·8 cites·13 claims
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