Inventor · disambiguated record
Masato Ishizaki
Also filed as: ISHIZAKI MASATO
12 granted patents·3 pending applications·56 citations·filing 1988–2021
88Inventor score
Top patents by PatentIndex Score
15 records- 0196USD839326SIngot moldIHI CORP·Filed 2017·Granted Jan 29, 2019·10 cites·1 claims
- 0296USD834624SIngot moldIHI CORP·Filed 2017·Granted Nov 27, 2018·14 cites·1 claims
- 0396USD833489SIngot moldIHI CORP·Filed 2017·Granted Nov 13, 2018·10 cites·1 claims
- 0496USD809575SIngot moldIHI CORP·Filed 2015·Granted Feb 6, 2018·12 cites·1 claims
- 0580US11718569B2Production method for composite materialIHI CORP·Filed 2020·Granted Aug 8, 2023·1 cites·7 claims
- 0671US9822445B2Method for manufacturing heat-resistant composite materialIHI CORP·Filed 2015·Granted Nov 21, 2017·1 cites·14 claims
- 0770US10221104B2Heat-resistant composite material production method and production deviceIHI CORP·Filed 2016·Granted Mar 5, 2019·1 cites·19 claims
- 0853US11319212B2Method for stabilizing chlorosilane polymerIHI CORP·Filed 2019·Granted May 3, 2022·0 cites·6 claims
- 0948US2021221744A1Ceramic matrix compositeIHI CORP·Filed 2019·Application pending·0 cites
- 1046US10507414B2Reheating collection device for gas phase processIHI CORP·Filed 2019·Granted Dec 17, 2019·0 cites·6 claims
- 1146US2018104862A1Fiber reinforced composite member molding apparatusIHI CORP·Filed 2017·Application pending·0 cites
- 1246US2018093398A1Fiber reinforced composite member molding apparatusIHI CORP·Filed 2017·Application pending·0 cites
- 1345US11178762B2Connection structure for wiring substrate and flexible substrate and package for housing electronic componentsNGK ELECTRONICS DEVICES INC·Filed 2020·Granted Nov 16, 2021·0 cites·8 claims
- 1444US11849538B2Composite wiring board, package, and electronic deviceNGK ELECTRONICS DEVICES INC·Filed 2021·Granted Dec 19, 2023·0 cites·10 claims
- 1543US5104633AMethod for producing high-purity metallic silicon and apparatus thereforKAWASAKI STEEL TECH RES·Filed 1988·Granted Apr 14, 1992·7 cites·18 claims
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