Inventor · disambiguated record
Juan G. Milla
Also filed as: MILLA JUAN G
9 granted patents·1 pending application·362 citations·filing 1995–2003
91Inventor score
Files withMEDTRONIC INC9
Top patents by PatentIndex Score
10 records- 0192US6991961B2Method of forming a high-voltage/high-power die packageMEDTRONIC INC·Filed 2003·Granted Jan 31, 2006·88 cites·24 claims
- 0292US5674258APackaged integrated accelerometerMEDTRONIC INC·Filed 1995·Granted Oct 7, 1997·109 cites·20 claims
- 0377US6057175AMethod of making encapsulated packageMEDTRONIC INC·Filed 1999·Granted May 2, 2000·57 cites·15 claims
- 0471US6963780B2Implantable medical device including a surface-mount terminal arrayMEDTRONIC INC·Filed 2002·Granted Nov 8, 2005·67 cites·16 claims
- 0570US6670217B2Methods for forming a die packageMEDTRONIC INC·Filed 2002·Granted Dec 30, 2003·10 cites·39 claims
- 0667US6696318B2Methods for forming a die packageMEDTRONIC INC·Filed 2002·Granted Feb 24, 2004·9 cites·39 claims
- 0765US6836022B2High voltage flip-chip component package and method for forming the sameMEDTRONIC INC·Filed 2003·Granted Dec 28, 2004·12 cites·18 claims
- 0859US7045390B2Stacked die packageMEDTRONIC INC·Filed 2003·Granted May 16, 2006·5 cites·22 claims
- 0950US6626931B2Implantable medical electronics using high voltage flip chip componentsMEDTRONIC INC·Filed 2000·Granted Sep 30, 2003·5 cites·8 claims
- 1039US2002121693A1Stacked die packageFiled 2000·Application pending·0 cites
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