Inventor · disambiguated record
Andreas Fenner
Also filed as: FENNER ANDREAS · FENNER ANDREAS A · FENNER ANDREAS ARMIN
24 granted patents·6 pending applications·459 citations·filing 1998–2024
96Inventor score
Top patents by PatentIndex Score
30 records- 0195US7142921B2Single axis accelerometer and method thereforeMEDTRONIC INC·Filed 2003·Granted Nov 28, 2006·65 cites·29 claims
- 0293US11865639B2Hermetic assembly and device including sameMEDTRONIC INC·Filed 2020·Granted Jan 9, 2024·2 cites·20 claims
- 0393US7902851B2Hermeticity testingMEDTRONIC INC·Filed 2009·Granted Mar 8, 2011·23 cites·20 claims
- 0490US10580544B2Power source and method of forming sameMEDTRONIC INC·Filed 2017·Granted Mar 3, 2020·7 cites·15 claims
- 0590US10290757B2Power source and method of forming sameMEDTRONIC INC·Filed 2016·Granted May 14, 2019·7 cites·19 claims
- 0686US8824161B2Integrated circuit packaging for implantable medical devicesASKARINYA MOHSEN·Filed 2012·Granted Sep 2, 2014·9 cites·12 claims
- 0785US6052623AFeedthrough assembly for implantable medical devices and methods for providing sameMEDTRONIC INC·Filed 1998·Granted Apr 18, 2000·233 cites·29 claims
- 0884US6806494B2Method and apparatus for wafer-level burn-in and testing of integrated circuitsMEDTRONIC INC·Filed 2003·Granted Oct 19, 2004·22 cites·9 claims
- 0983US10096393B2Nuclear radiation particle power converterMEDTRONIC INC·Filed 2015·Granted Oct 9, 2018·4 cites·15 claims
- 1083US9252415B2Power sources suitable for use in implantable medical devices and corresponding fabrication methodsASKARINYA MOHSEN·Filed 2012·Granted Feb 2, 2016·4 cites·4 claims
- 1180US7167074B2Integrated planar flyback transformerMEDTRONIC INC·Filed 2005·Granted Jan 23, 2007·13 cites·9 claims
- 1277US12233477B2Hermetic assembly and device including sameMEDTRONIC INC·Filed 2024·Granted Feb 25, 2025·0 cites·20 claims
- 1376US6627917B1Method and apparatus for wafer-level burn-inMEDTRONIC INC·Filed 2000·Granted Sep 30, 2003·24 cites·15 claims
- 1471US6548826B2Apparatus for wafer-level burn-in and testing of integrated circuitsFiled 2001·Granted Apr 15, 2003·11 cites·6 claims
- 1568US11881325B2Nuclear radiation particle power converterMEDTRONIC INC·Filed 2020·Granted Jan 23, 2024·0 cites·17 claims
- 1668US6707065B2Method and apparatus for wafer-level burn-in and testing of integrated circuitsMEDTRONIC INC·Filed 2002·Granted Mar 16, 2004·10 cites·3 claims
- 1767US8084841B2Systems and methods for providing high-density capacitorsPULUGURTHA MARKONDEYARAJ·Filed 2009·Granted Dec 27, 2011·6 cites·37 claims
- 1865US11189390B2Power source and method of forming sameMEDTRONIC INC·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 1965US6836022B2High voltage flip-chip component package and method for forming the sameMEDTRONIC INC·Filed 2003·Granted Dec 28, 2004·12 cites·18 claims
- 2062US10811157B2Nuclear radiation particle power converterMEDTRONIC INC·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 2161US10818811B2Power source and method of forming sameMEDTRONIC INC·Filed 2019·Granted Oct 27, 2020·0 cites·19 claims
- 2257US2014374145A1Hermetically-sealed electrical circuit apparatusMEDTRONIC INC·Filed 2014·Application pending·0 cites
- 2354US11725995B2Pressure sensor assembly for use in implantable medical device including a substrate having via that extends through substrate along via axis between first major surface and second major surface of substrateMEDTRONIC INC·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 2453US2025065135A1Enclosures with hermetic feedthroughsMEDTRONIC INC·Filed 2022·Application pending·0 cites
- 2552US7196889B2Zener triggered overvoltage protection deviceMEDTRONIC INC·Filed 2002·Granted Mar 27, 2007·7 cites·9 claims
- 2651US9496241B2Integrated circuit packaging for implantable medical devicesMEDTRONIC INC·Filed 2014·Granted Nov 15, 2016·0 cites·10 claims
- 2739US2003080401A1Interconnection of active and passive components in substrateFiled 2002·Application pending·0 cites
- 2837US2014273824A1Systems, apparatus and methods facilitating secure pairing of an implantable device with a remote device using near field communicationMEDTRONIC INC·Filed 2013·Application pending·0 cites
- 2937US2002074633A1Interconnection of active and passive components in substrateFiled 2000·Application pending·0 cites
- 3037US2010284123A1Systems and methods for fabricating high-density capacitorsPULUGURTHA MARKONDEYARAJ·Filed 2009·Application pending·0 cites
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