Inventor · disambiguated record
Jin-Hwan Chun
Also filed as: CHUN JIN HWAN
9 granted patents·22 citations·filing 2019–2023
83Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0197US11121134B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 14, 2021·7 cites·20 claims
- 0296US11594538B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 28, 2023·4 cites·20 claims
- 0393US11282787B2Semiconductor devices having improved electrical characteristics and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·3 cites·18 claims
- 0489US10825819B2Semiconductor device including spacer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 3, 2020·5 cites·15 claims
- 0587US11342331B2Semiconductor device including an air spacer and a method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 0675US11929324B2Semiconductor devices having improved electrical characteristics and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 12, 2024·0 cites·20 claims
- 0771US11658117B2Semiconductor devices having improved electrical characteristics and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·0 cites·20 claims
- 0869US10886167B2Semiconductor device for improving device characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 5, 2021·1 cites·20 claims
- 0960US11282841B2Method of manufacturing semiconductor device including spacerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →