Inventor · disambiguated record
Reynaldo A. Olmedo
Also filed as: OLMEDO REYNALDO · OLMEDO REYNALDO A · OLMEDO REYNALDO ALBERTO
6 granted patents·1 pending application·44 citations·filing 2008–2019
80Inventor score
Top patents by PatentIndex Score
7 records- 0191US9685413B1Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2016·Granted Jun 20, 2017·12 cites·16 claims
- 0289US8461036B2Multiple surface finishes for microelectronic package substratesWU TAO·Filed 2009·Granted Jun 11, 2013·26 cites·20 claims
- 0380US9911723B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2015·Granted Mar 6, 2018·3 cites·11 claims
- 0474US9991211B2Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2017·Granted Jun 5, 2018·2 cites·14 claims
- 0569US10340260B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2018·Granted Jul 2, 2019·1 cites·8 claims
- 0658US10741536B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2019·Granted Aug 11, 2020·0 cites·10 claims
- 0748US2009321932A1Coreless substrate package with symmetric external dielectric layersGONZALEZ JAVIER SOTO·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →