Inventor · disambiguated record
Robert Starkston
Also filed as: STARKSTON ROBERT
32 granted patents·4 pending applications·544 citations·filing 1984–2025
97Inventor score
Top patents by PatentIndex Score
36 records- 0199US9269701B2Localized high density substrate routingINTEL CORP·Filed 2015·Granted Feb 23, 2016·49 cites·20 claims
- 0297US9679843B2Localized high density substrate routingINTEL CORP·Filed 2016·Granted Jun 13, 2017·17 cites·20 claims
- 0396US9136236B2Localized high density substrate routingSTARKSTON ROBERT·Filed 2012·Granted Sep 15, 2015·69 cites·16 claims
- 0494US10366951B2Localized high density substrate routingINTEL CORP·Filed 2017·Granted Jul 30, 2019·7 cites·20 claims
- 0593US11923257B2Hybrid microelectronic substratesINTEL CORP·Filed 2021·Granted Mar 5, 2024·2 cites·18 claims
- 0693US11515248B2Localized high density substrate routingINTEL CORP·Filed 2020·Granted Nov 29, 2022·2 cites·22 claims
- 0793US6617683B2Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface materialINTEL CORP·Filed 2001·Granted Sep 9, 2003·99 cites·26 claims
- 0891US2024421073A1Localized high density substrate routingINTEL CORP·Filed 2024·Application pending·0 cites
- 0991US2025323145A1Localized high density substrate routingINTEL CORP·Filed 2025·Application pending·0 cites
- 1088US6191475B1Substrate for reducing electromagnetic interference and enclosureINTEL CORP·Filed 1997·Granted Feb 20, 2001·114 cites·23 claims
- 1183US11984396B2Localized high density substrate routingINTEL CORP·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 1283US7332423B2Soldering a die to a substrateINTEL CORP·Filed 2005·Granted Feb 19, 2008·14 cites·12 claims
- 1382US12107042B2Localized high density substrate routingINTEL CORP·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 1481US6043983AEMI containment for microprocessor core mounted on a card using surface mounted clipsINTEL CORP·Filed 1998·Granted Mar 28, 2000·47 cites·13 claims
- 1580US8364304B2Methods and apparatus for laser scribing wafersINTEL CORP·Filed 2010·Granted Jan 29, 2013·4 cites·11 claims
- 1677US9832860B2Panel level fabrication of package substrates with integrated stiffenersINTEL CORP·Filed 2014·Granted Nov 28, 2017·4 cites·15 claims
- 1777US9001520B2Microelectronic structures having laminated or embedded glass routing structures for high density packagingINTEL CORP·Filed 2012·Granted Apr 7, 2015·3 cites·7 claims
- 1874US11114353B2Hybrid microelectronic substratesINTEL CORP·Filed 2016·Granted Sep 7, 2021·2 cites·20 claims
- 1973US7015592B2Marking on underfillINTEL CORP·Filed 2004·Granted Mar 21, 2006·18 cites·26 claims
- 2073US4539189AMethod for removing sulfides from industrial gasCHEVRON RES·Filed 1984·Granted Sep 3, 1985·32 cites·11 claims
- 2170US10008452B2Microelectronic structures having laminated or embedded glass routing structures for high density packagingINTEL CORP·Filed 2017·Granted Jun 26, 2018·1 cites·20 claims
- 2266US6239973B1EMI containment for microprocessor core mounted on a card using surface mounted clipsINTEL CORP·Filed 2000·Granted May 29, 2001·12 cites·16 claims
- 2364US10796988B2Localized high density substrate routingINTEL CORP·Filed 2018·Granted Oct 6, 2020·0 cites·14 claims
- 2462US7772090B2Methods for laser scribing wafersINTEL CORP·Filed 2003·Granted Aug 10, 2010·7 cites·5 claims
- 2561US7223638B2Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface materialINTEL CORP·Filed 2004·Granted May 29, 2007·9 cites·19 claims
- 2659US11444033B2Hybrid microelectronic substrate and methods for fabricating the sameINTEL CORP·Filed 2020·Granted Sep 13, 2022·0 cites·19 claims
- 2758US4647397AComposition for removing sulfides from industrial gasCHEVRON RES·Filed 1985·Granted Mar 3, 1987·21 cites·9 claims
- 2852US9642248B2Microelectronic structures having laminated or embedded glass routing structures for high density packagingINTEL CORP·Filed 2015·Granted May 2, 2017·0 cites·12 claims
- 2951US11022792B2Coupling a magnet with a MEMS deviceINTEL CORP·Filed 2016·Granted Jun 1, 2021·0 cites·20 claims
- 3047US10763215B2Hybrid microelectronic substrate and methods for fabricating the sameINTEL CORP·Filed 2015·Granted Sep 1, 2020·0 cites·7 claims
- 3144US10125013B2Microelectromechanical system with spring for magnet placementINTEL CORP·Filed 2016·Granted Nov 13, 2018·0 cites·25 claims
- 3243US6043560AThermal interface thickness control for a microprocessorINTEL CORP·Filed 1997·Granted Mar 28, 2000·11 cites·11 claims
- 3335US10716214B2Hybrid microelectronic substrate and methods for fabricating the sameINTEL CORP·Filed 2015·Granted Jul 14, 2020·0 cites·21 claims
- 3433US2021202441A1System and method for stacking wire-bond converted flip-chip dieINTEL CORP·Filed 2016·Application pending·0 cites
- 3531US10304769B2Multi-die packageINTEL CORP·Filed 2015·Granted May 28, 2019·0 cites·17 claims
- 3629US2016268213A1On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI RisksINTEL CORP·Filed 2015·Application pending·0 cites
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