Inventor · disambiguated record
Shigetsugu Muramatsu
Also filed as: MURAMATSU SHIGETSUGU
29 granted patents·7 pending applications·407 citations·filing 1995–2013
97Inventor score
Top patents by PatentIndex Score
36 records- 0189US6465886B1Semiconductor device having circuit pattern and lands thereonSHINKO ELECTRIC IND CO·Filed 2000·Granted Oct 15, 2002·56 cites·3 claims
- 0283US8835773B2Wiring board and method of manufacturing the sameMURAMATSU SHIGETSUGU·Filed 2010·Granted Sep 16, 2014·8 cites·4 claims
- 0380US9000474B2Wiring substrate, light emitting device, and manufacturing method of wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Apr 7, 2015·4 cites·10 claims
- 0480US6628527B2Mounting structure for electronic parts and manufacturing method thereofSHINKO ELECTRIC IND COMPANY LT·Filed 2000·Granted Sep 30, 2003·31 cites·4 claims
- 0578US9029891B2Wiring substrate, light emitting device, and manufacturing method of wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted May 12, 2015·4 cites·6 claims
- 0678US8115300B2Wiring substrate and manufacturing method thereof, and semiconductor apparatusMURAMATSU SHIGETSUGU·Filed 2007·Granted Feb 14, 2012·7 cites·6 claims
- 0774US6420664B1Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrateSHINKO ELECTRIC IND CO·Filed 1999·Granted Jul 16, 2002·35 cites·21 claims
- 0873US8037596B2Method for manufacturing a wiring boardSHINKO ELECTRIC IND CO·Filed 2007·Granted Oct 18, 2011·4 cites·6 claims
- 0973US7438945B2Method of producing multilayer interconnection boardSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 21, 2008·4 cites·5 claims
- 1073US6256207B1Chip-sized semiconductor device and process for making sameSHINKO ELECTRIC IND CO·Filed 1999·Granted Jul 3, 2001·43 cites·16 claims
- 1173US5943212ACeramic circuit board and semiconductor device using sameSHINKO ELECTRIC IND CO·Filed 1997·Granted Aug 24, 1999·46 cites·11 claims
- 1272US8222532B2Method for manufacturing a wiring boardMURAMATSU SHIGETSUGU·Filed 2011·Granted Jul 17, 2012·3 cites·8 claims
- 1368US9084372B2Wiring substrate, light emitting device, and manufacturing method of wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Jul 14, 2015·2 cites·12 claims
- 1468US8575495B2Wiring substrate, semiconductor device, and method for manufacturing wiring substrateMURAMATSU SHIGETSUGU·Filed 2011·Granted Nov 5, 2013·3 cites·13 claims
- 1566US6730859B2Substrate for mounting electronic parts thereon and method of manufacturing sameSHINKO ELECTRIC IND CO·Filed 2001·Granted May 4, 2004·12 cites·17 claims
- 1662US6335493B1Multilayer wiring boardSHINKO ELECTRIC IND CO·Filed 1999·Granted Jan 1, 2002·22 cites·4 claims
- 1760US6455786B1Wiring board and manufacturing method thereof and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Sep 24, 2002·9 cites·12 claims
- 1856US9741647B2Wiring substrate, semiconductor device, and method of manufacturing wiring substrateMURAMATSU SHIGETSUGU·Filed 2011·Granted Aug 22, 2017·1 cites·12 claims
- 1956US8508050B2Wiring substrate, semiconductor device, and method for manufacturing wiring substrateMURAMATSU SHIGETSUGU·Filed 2011·Granted Aug 13, 2013·1 cites·11 claims
- 2056US7180182B2Semiconductor componentSHINKO ELECTRIC IND CO·Filed 2002·Granted Feb 20, 2007·7 cites·7 claims
- 2155US7183196B2Multilayer interconnection board and production method thereofSHINKO ELECTRIC IND CO·Filed 2004·Granted Feb 27, 2007·5 cites·5 claims
- 2253US6242799B1Anisotropic stress buffer and semiconductor device using the sameSHINKO ELECTRIC IND CO·Filed 1998·Granted Jun 5, 2001·18 cites·12 claims
- 2353US6110755AMethod for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1998·Granted Aug 29, 2000·19 cites·6 claims
- 2451US6011300ASemiconductor integrated circuit deviceSHINKO ELECTRIC IND CO·Filed 1997·Granted Jan 4, 2000·14 cites·6 claims
- 2551US2010090352A1Flip-chip substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 2650US2005161157A1Substrate treating apparatus and methodSHINKO ELECTRIC IND CO·Filed 2005·Application pending·0 cites
- 2749US6444494B1Process of packaging a semiconductor device with reinforced film substrateSHINKO ELECTRIC IND CO·Filed 1999·Granted Sep 3, 2002·15 cites·11 claims
- 2848US5904488ASemiconductor integrated circuit deviceSHINKO ELECTRIC IND CO·Filed 1997·Granted May 18, 1999·12 cites·4 claims
- 2948US2008283277A1Wiring board manufacturing method and wiring boardSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 3045US5744224ABoard for mounting semiconductor chipSHINKO ELECTRIC IND CO·Filed 1995·Granted Apr 28, 1998·12 cites·22 claims
- 3144US6998291B2Cost-reducing and process-simplifying wiring board and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2004·Granted Feb 14, 2006·3 cites·3 claims
- 3244US2008223612A1Wiring substrate and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 3344US2007200211A1Multilayer wiring substrate and method of connecting the sameSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
- 3444US2010101851A1Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 3543US2006043570A1Substrate, semiconductor device, substrate fabricating method, and semiconductor device fabricating methodMURAMATSU SHIGETSUGU·Filed 2005·Application pending·0 cites
- 3638US6404214B1Substrate for inspecting electronic device, method of manufacturing substrate, and method of inspecting electronic deviceSHINKO ELECTRIC IND CO·Filed 1999·Granted Jun 11, 2002·7 cites·23 claims
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