Inventor · disambiguated record
Wu Hu Li
Also filed as: LI WU HU
10 granted patents·1 pending application·4 citations·filing 2006–2022
81Inventor score
Top patents by PatentIndex Score
11 records- 0188US12002724B2Power module with metal substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Jun 4, 2024·1 cites·7 claims
- 0279US11404336B2Power module with metal substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Aug 2, 2022·1 cites·11 claims
- 0372US11450642B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Sep 20, 2022·0 cites·15 claims
- 0471US10615145B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 7, 2020·0 cites·10 claims
- 0570US10896893B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 19, 2021·0 cites·20 claims
- 0669US10892247B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 12, 2021·0 cites·20 claims
- 0756US8125060B2Electronic component with layered frameLI WU HU·Filed 2006·Granted Feb 28, 2012·2 cites·18 claims
- 0843US8703544B2Electronic component employing a layered frameLI WU HU·Filed 2012·Granted Apr 22, 2014·0 cites·19 claims
- 0942US2020381314A1Method for Providing Coated Leadframes or for Measuring an Adhesion Force of an Encapsulant on a LeadframeINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 1038US7875968B2Leadframe, semiconductor package and support lead for bonding with groundwiresINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 25, 2011·0 cites·28 claims
- 1137US10366946B2Connection member with bulk body and electrically and thermally conductive coatingINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 30, 2019·0 cites·20 claims
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