Inventor · disambiguated record
Wolfgang Peinhopf
Also filed as: PEINHOPF WOLFGANG
4 granted patents·1 pending application·6 citations·filing 2008–2013
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0174US8253225B2Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereofOTREMBA RALF·Filed 2008·Granted Aug 28, 2012·6 cites·19 claims
- 0247US9035437B2Packaged device comprising non-integer lead pitches and method of manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted May 19, 2015·0 cites·18 claims
- 0347US8618644B2Electronic device and manufacturing thereofOTREMBA RALF·Filed 2012·Granted Dec 31, 2013·0 cites·15 claims
- 0443US9099391B2Semiconductor package with top-side insulation layerINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 4, 2015·0 cites·7 claims
- 0541US2014210061A1Chip arrangement and chip packageINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →