Inventor · disambiguated record
Venkatesh Mohanakrishnaswamy
Also filed as: MOHANAKRISHNASWAMY VENKATESH
9 granted patents·8 citations·filing 2008–2013
79Inventor score
Top patents by PatentIndex Score
9 records- 0176US7943410B2Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of formingST MICROELECTRONICS INC·Filed 2008·Granted May 17, 2011·6 cites·19 claims
- 0262US8193595B2Method of forming a die having an IC region adjacent a MEMS regionMOHANAKRISHNASWAMY VENKATESH·Filed 2009·Granted Jun 5, 2012·2 cites·22 claims
- 0358US8680631B2High aspect ratio capacitively coupled MEMS devicesST MICROELECTRONICS INC·Filed 2013·Granted Mar 25, 2014·0 cites·16 claims
- 0457US8022491B2High aspect ratio all SiGe capacitively coupled MEMS devicesST MICROELECTRONICS INC·Filed 2009·Granted Sep 20, 2011·0 cites·26 claims
- 0553US8432006B2High aspect ratio capacitively coupled MEMS devicesMOHANAKRISHNASWAMY VENKATESH·Filed 2011·Granted Apr 30, 2013·0 cites·18 claims
- 0649USRE45286EEmbedded microelectromechanical systems (MEMS) semiconductor substrate and related method of formingST MICROELECTRONICS INC·Filed 2013·Granted Dec 9, 2014·0 cites·37 claims
- 0749US8853850B2MEMS packaging scheme using dielectric fenceST MICROELECTRONICS INC·Filed 2013·Granted Oct 7, 2014·0 cites·15 claims
- 0849US8405202B2MEMS packaging scheme using dielectric fenceMOHANAKRISHNASWAMY VENKATESH·Filed 2009·Granted Mar 26, 2013·0 cites·18 claims
- 0945US8853802B2Method of forming a die having an IC region adjacent a MEMS regionMOHANAKRISHNASWAMY VENKATESH·Filed 2012·Granted Oct 7, 2014·0 cites·20 claims
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