Inventor · disambiguated record
Jung-Hye Kim
Also filed as: KIM JUNG-HYE
7 granted patents·2 pending applications·11 citations·filing 2004–2023
75Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0179US9897753B2Optical device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 20, 2018·3 cites·19 claims
- 0271US11747556B2Integrated circuit device including photoelectronic elementSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·19 claims
- 0366US11287570B2Integrated circuit device including photoelectronic elementSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 29, 2022·0 cites·18 claims
- 0461US12159890B2Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 0559US7423444B2Digital test apparatus for testing analog semiconductor device(s)SAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 9, 2008·2 cites·13 claims
- 0656US7618832B2Semiconductor substrate having reference semiconductor chip and method of assembling semiconductor chip using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 17, 2009·0 cites·14 claims
- 0750US7268573B2Apparatus for generating test stimulus signal having current regardless of internal impedance changes of device under testSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 11, 2007·6 cites·16 claims
- 0839US2014212087A1Semiconductor apparatus including an optical device and an electronic device, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 0938US2007066094A1Package having balls designed to reduce contact resistance, test apparatus for testing the package, and method of manufacturing the packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →