Inventor · disambiguated record
Mariam Sadaka
Also filed as: SADAKA MARIAM · SADAKA MARIAM G · SADAKA MARIAM GERGI
82 granted patents·10 pending applications·2,262 citations·filing 2000–2020
99Inventor score
Files withFREESCALE SEMICONDUCTOR INC33SADAKA MARIAM19SOITEC SILICON ON INSULATOR18FLEXTRONICS INT USA INC4NGUYEN BICH-YEN4
Top patents by PatentIndex Score
92 records- 0199US8697493B2Bonding surfaces for direct bonding of semiconductor structuresSADAKA MARIAM·Filed 2011·Granted Apr 15, 2014·225 cites·13 claims
- 0298US8716105B2Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methodsSADAKA MARIAM·Filed 2011·Granted May 6, 2014·219 cites·28 claims
- 0398US8501537B2Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methodsSADAKA MARIAM·Filed 2011·Granted Aug 6, 2013·221 cites·18 claims
- 0497US7282402B2Method of making a dual strained channel semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Oct 16, 2007·69 cites·19 claims
- 0597US7226833B2Semiconductor device structure and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Jun 5, 2007·124 cites·18 claims
- 0696US8461017B2Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened regionSADAKA MARIAM·Filed 2010·Granted Jun 11, 2013·27 cites·21 claims
- 0796US7655963B2Semiconductor device including a lateral field-effect transistor and Schottky diodeFLEXTRONICS INT USA INC·Filed 2007·Granted Feb 2, 2010·36 cites·20 claims
- 0896US7575968B2Inverse slope isolation and dual surface orientation integrationFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 18, 2009·533 cites·21 claims
- 0996US6893947B2Advanced RF enhancement-mode FETs with improved gate propertiesFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted May 17, 2005·124 cites·23 claims
- 1095US7018901B1Method for forming a semiconductor device having a strained channel and a heterojunction source/drainFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Mar 28, 2006·105 cites·24 claims
- 1194US7435639B2Dual surface SOI by lateral epitaxial overgrowthFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 14, 2008·34 cites·20 claims
- 1293US8842945B2Methods of forming three dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substratesNGUYEN BICH-YEN·Filed 2011·Granted Sep 23, 2014·16 cites·17 claims
- 1393US7575975B2Method for forming a planar and vertical semiconductor structure having a strained semiconductor layerFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Aug 18, 2009·34 cites·17 claims
- 1492US8866305B2Methods of forming bonded semiconductor structuresSOITEC SILICON ON INSULATOR·Filed 2013·Granted Oct 21, 2014·12 cites·21 claims
- 1592US7524707B2Modified hybrid orientation technologyFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Apr 28, 2009·19 cites·15 claims
- 1692US7504673B2Semiconductor device including a lateral field-effect transistor and Schottky diodeFLEXTRONICS INT USA INC·Filed 2007·Granted Mar 17, 2009·16 cites·20 claims
- 1791US9219150B1Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structuresSOITEC SILICON ON INSULATOR·Filed 2014·Granted Dec 22, 2015·9 cites·18 claims
- 1890US9293448B2Methods of forming three-dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substratesSOITEC SILICON ON INSULATOR·Filed 2014·Granted Mar 22, 2016·9 cites·24 claims
- 1990US9165945B1Method for fabricating semiconductor structures including transistor channels having different strain states, and related semiconductor structuresSOITEC SILICON ON INSULATOR·Filed 2014·Granted Oct 20, 2015·8 cites·13 claims
- 2090US9041214B2Bonded processed semiconductor structures and carriersSOITEC SILICON ON INSULATOR·Filed 2013·Granted May 26, 2015·8 cites·20 claims
- 2189US9245836B2Interposers including fluidic microchannels and related structures and methodsSADAKA MARIAM·Filed 2012·Granted Jan 26, 2016·8 cites·10 claims
- 2289US8637995B2Bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrateSOITEC SILICON ON INSULATOR·Filed 2012·Granted Jan 28, 2014·9 cites·11 claims
- 2389US7803670B2Twisted dual-substrate orientation (DSO) substratesFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Sep 28, 2010·19 cites·19 claims
- 2488US8673733B2Methods of transferring layers of material in 3D integration processes and related structures and devicesSADAKA MARIAM·Filed 2011·Granted Mar 18, 2014·10 cites·26 claims
- 2588US8058158B2Hybrid semiconductor substrate including semiconductor-on-insulator region and method of making the sameBOURDELLE KONSTANTIN·Filed 2010·Granted Nov 15, 2011·10 cites·18 claims
- 2687US8338294B2Methods of forming bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate, and semiconductor structures formed by such methodsSADAKA MARIAM·Filed 2011·Granted Dec 25, 2012·8 cites·12 claims
- 2787US7675090B2Semiconductor device having a contact on a buffer layer thereof and method of forming the sameFLEXTRONICS INT USA INC·Filed 2007·Granted Mar 9, 2010·11 cites·20 claims
- 2887US7564074B2Semiconductor device including a lateral field-effect transistor and Schottky diodeFLEXTRONICS INT USA INC·Filed 2007·Granted Jul 21, 2009·14 cites·20 claims
- 2987US7265004B2Electronic devices including a semiconductor layer and a process for forming the sameFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 4, 2007·15 cites·14 claims
- 3087US7067868B2Double gate device having a heterojunction source/drain and strained channelFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Jun 27, 2006·39 cites·17 claims
- 3186US8970045B2Methods for fabrication of semiconductor structures including interposers with conductive vias, and related structures and devicesSADAKA MARIAM·Filed 2012·Granted Mar 3, 2015·7 cites·27 claims
- 3286US7029980B2Method of manufacturing SOI template layerFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Apr 18, 2006·25 cites·17 claims
- 3385US11876348B2Trench process for dense VCSEL designAPPLE INC·Filed 2020·Granted Jan 16, 2024·1 cites·22 claims
- 3485US8481406B2Methods of forming bonded semiconductor structuresSADAKA MARIAM·Filed 2010·Granted Jul 9, 2013·7 cites·24 claims
- 3585US7378306B2Selective silicon deposition for planarized dual surface orientation integrationFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 27, 2008·14 cites·20 claims
- 3683US7821067B2Electronic devices including a semiconductor layerFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Oct 26, 2010·11 cites·20 claims
- 3781US7208357B2Template layer formationFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Apr 24, 2007·18 cites·26 claims
- 3880US7037795B1Low RC product transistors in SOI semiconductor processFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted May 2, 2006·26 cites·17 claims
- 3979US9818874B2Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structuresSOITEC SILICON ON INSULATOR·Filed 2016·Granted Nov 14, 2017·2 cites·20 claims
- 4077US9553014B2Bonded processed semiconductor structures and carriersSOITEC SILICON ON INSULATOR·Filed 2015·Granted Jan 24, 2017·2 cites·19 claims
- 4177US7611937B2High performance transistors with hybrid crystal orientationsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 3, 2009·7 cites·14 claims
- 4275US8125032B2Modified hybrid orientation technologyADETUTU OLUBUNMI O·Filed 2009·Granted Feb 28, 2012·5 cites·20 claims
- 4375US7615806B2Method for forming a semiconductor structure and structure thereofFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Nov 10, 2009·6 cites·19 claims
- 4475US7544548B2Trench liner for DSO integrationFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jun 9, 2009·6 cites·22 claims
- 4575US6465297B1Method of manufacturing a semiconductor component having a capacitorMOTOROLA INC·Filed 2000·Granted Oct 15, 2002·18 cites·21 claims
- 4674US6368929B1Method of manufacturing a semiconductor component and semiconductor component thereofMOTOROLA INC·Filed 2000·Granted Apr 9, 2002·16 cites·12 claims
- 4773US8778773B2Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methodsSADAKA MARIAM·Filed 2010·Granted Jul 15, 2014·3 cites·42 claims
- 4873US7754587B2Silicon deposition over dual surface orientation substrates to promote uniform polishingFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jul 13, 2010·4 cites·20 claims
- 4972US7781840B2Semiconductor device structureFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 24, 2010·4 cites·6 claims
- 5071US10553562B2Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methodsSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Feb 4, 2020·1 cites·20 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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