Inventor · disambiguated record
Philip H. Chen
Also filed as: CHEN PHILIP · CHEN PHILIP H · CHEN PHILIP S
13 granted patents·2 pending applications·373 citations·filing 1997–2022
92Inventor score
Top patents by PatentIndex Score
15 records- 0193US5963429APrinted circuit substrate with cavities for encapsulating integrated circuitsSULZER INTERMEDICS INC·Filed 1997·Granted Oct 5, 1999·173 cites·8 claims
- 0278US6426880B1Surface mounted device with grooves on a termination leadINTERMEDICS INC·Filed 2000·Granted Jul 30, 2002·20 cites·43 claims
- 0374US6246587B1Surface mounted device with grooves on a termination lead and methods of assemblyINTERMEDICS INC·Filed 1998·Granted Jun 12, 2001·27 cites·25 claims
- 0473US7833879B2Low temperature hermetic bonding at water level and method of bonding for micro display applicationMIRADIA INC·Filed 2009·Granted Nov 16, 2010·5 cites·17 claims
- 0569US7585747B1Low temperature hermetic bonding at water level and method of bonding for micro display applicationMIRADIA INC·Filed 2005·Granted Sep 8, 2009·4 cites·22 claims
- 0665US7825519B2Method and device for wafer scale packaging of optical devices using a scribe and break processMIRADIA INC·Filed 2008·Granted Nov 2, 2010·2 cites·7 claims
- 0765US5987358ASemiconductor device packaging and method of fabricationINTERMEDICS INC·Filed 1998·Granted Nov 16, 1999·106 cites·7 claims
- 0858US7344956B2Method and device for wafer scale packaging of optical devices using a scribe and break processMIRADIA INC·Filed 2004·Granted Mar 18, 2008·6 cites·12 claims
- 0957US6406940B1Method and apparatus for stacking IC devicesINTERMEDICS INC·Filed 2000·Granted Jun 18, 2002·8 cites·19 claims
- 1049US9006878B2Method and device for wafer scale packaging of optical devices using a scribe and break processYANG XIAO “CHARLES”·Filed 2010·Granted Apr 14, 2015·0 cites·14 claims
- 1148US6251219B1Method and apparatus for use in assembling electronic devicesINTERMEDICS INC·Filed 1998·Granted Jun 26, 2001·16 cites·22 claims
- 1244US2025179638A1Showerhead assembly and substrate processing systems for improving deposition thickness uniformityLAM RES CORP·Filed 2022·Application pending·0 cites
- 1342US2004093928A1Rare earth metal sensorFiled 2002·Application pending·0 cites
- 1432US6182357B1Method and apparatus for dicing electronic substrateINTERMEDICS INC·Filed 1999·Granted Feb 6, 2001·6 cites·21 claims
- 1521USD1107670SShowerhead for a substrate processing systemLAM RES CORP·Filed 2022·Granted Dec 30, 2025·0 cites·1 claims
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