Inventor · disambiguated record
Tatsuharu Matsuda
Also filed as: MATSUDA TATSUHARU
8 granted patents·307 citations·filing 1994–1997
90Inventor score
Files withFUJITSU LTD8
Top patents by PatentIndex Score
8 records- 0185US5666270ABump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrodeFUJITSU LTD·Filed 1994·Granted Sep 9, 1997·88 cites·20 claims
- 0281US5831441ATest board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor deviceFUJITSU LTD·Filed 1996·Granted Nov 3, 1998·58 cites·2 claims
- 0380US5574311ADevice having pins formed of hardened mixture of conductive metal particle and resinFUJITSU LTD·Filed 1994·Granted Nov 12, 1996·56 cites·7 claims
- 0464US5843798AMethod for manufacturing semiconductor device having step of forming electrode pins on semiconductor chip using electrode-pin forming mask, and method for testing semiconductor chip using electrode-pin forming maskFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·28 cites·4 claims
- 0562US5937277ASemiconductor device with reliable electrodes of projecting shape and method of forming sameFUJITSU LTD·Filed 1997·Granted Aug 10, 1999·18 cites·7 claims
- 0656US5607877AProjection-electrode fabrication methodFUJITSU LTD·Filed 1994·Granted Mar 4, 1997·23 cites·3 claims
- 0753US5854558ATest board for testing a semiconductor device and method of testing the semiconductor deviceFUJITSU LTD·Filed 1995·Granted Dec 29, 1998·25 cites·10 claims
- 0849US5637535ASemiconductor device with reliable electrodes of projecting shape and method of forming sameFUJITSU LTD·Filed 1995·Granted Jun 10, 1997·11 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →