Inventor · disambiguated record

Teru Hirata

Also filed as: HIRATA TERU

2 granted patents·234 citations·filing 1995–1995

69Inventor score

Technology areasH10W

Files withMITSUBISHI ELECTRIC CORP2

Top patents by PatentIndex Score

2 records

0191US5766972AMethod of making resin encapsulated semiconductor device with bump electrodesMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jun 16, 1998·224 cites·7 claims
0241US5521433AIC card including a substrate having improved strength and heat radiation propertiesMITSUBISHI ELECTRIC CORP·Filed 1995·Granted May 28, 1996·10 cites·9 claims

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