Inventor · disambiguated record
George A. Bednarz
Also filed as: BEDNARZ GEORGE A
11 granted patents·411 citations·filing 1988–2002
93Inventor score
Files withTEXAS INSTRUMENTS INC11
Top patents by PatentIndex Score
11 records- 0196US6489178B2Method of fabricating a molded package for micromechanical devicesTEXAS INSTRUMENTS INC·Filed 2001·Granted Dec 3, 2002·111 cites·13 claims
- 0292US6858910B2Method of fabricating a molded package for micromechanical devicesTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 22, 2005·59 cites·16 claims
- 0389US7026710B2Molded package for micromechanical devices and method of fabricationTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 11, 2006·53 cites·9 claims
- 0477US5106784AMethod of making a post molded cavity package with internal dam bar for integrated circuitTEXAS INSTRUMENTS INC·Filed 1990·Granted Apr 21, 1992·57 cites·6 claims
- 0574US4874722AProcess of packaging a semiconductor device with reduced stress forcesTEXAS INSTRUMENTS INC·Filed 1988·Granted Oct 17, 1989·47 cites·8 claims
- 0661US5624691ATransfer mold designTEXAS INSTRUMENTS INC·Filed 1994·Granted Apr 29, 1997·21 cites·6 claims
- 0757US6071457ABellows container packaging system and methodTEXAS INSTRUMENTS INC·Filed 1998·Granted Jun 6, 2000·19 cites·20 claims
- 0856US5955115APre-packaged liquid molding for component encapsulationTEXAS INSTRUMENTS INC·Filed 1996·Granted Sep 21, 1999·24 cites·10 claims
- 0943US5744083AMethod for molding semiconductor packagesTEXAS INSTRUMENTS INC·Filed 1996·Granted Apr 28, 1998·10 cites·2 claims
- 1034US5912024ASproutless pre-packaged molding for component encapsulationTEXAS INSTRUMENTS INC·Filed 1996·Granted Jun 15, 1999·6 cites·5 claims
- 1131US6531083B1Sproutless pre-packaged molding for component encapsulationTEXAS INSTRUMENTS INC·Filed 1995·Granted Mar 11, 2003·4 cites·8 claims
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