Inventor · disambiguated record
Voddarahalli K. Nagesh
Also filed as: NAGESH VODDARAHALLI K
11 granted patents·744 citations·filing 1977–1995
94Inventor score
Top patents by PatentIndex Score
11 records- 0190US5621615ALow cost, high thermal performance package for flip chips with low mechanical stress on chipHEWLETT PACKARD CO·Filed 1995·Granted Apr 15, 1997·135 cites·5 claims
- 0290US5324569AComposite transversely plastic interconnect for microchip carrierHEWLETT PACKARD CO·Filed 1993·Granted Jun 28, 1994·119 cites·7 claims
- 0389US5585671AReliable low thermal resistance package for high power flip clip ICsFiled 1994·Granted Dec 17, 1996·116 cites·9 claims
- 0488US4130671AMethod for preparing a thick film conductorUS ENERGY·Filed 1977·Granted Dec 19, 1978·64 cites·17 claims
- 0584US5409157AComposite transversely plastic interconnect for microchip carrierFiled 1994·Granted Apr 25, 1995·79 cites·6 claims
- 0682US5155661AAluminum nitride multi-chip moduleHEWLETT PACKARD CO·Filed 1991·Granted Oct 13, 1992·73 cites·5 claims
- 0771US5484964ASurface mounting pin grid arraysFiled 1995·Granted Jan 16, 1996·50 cites·9 claims
- 0870US5113314AHigh-speed, high-density chip mountingHEWLETT PACKARD CO·Filed 1991·Granted May 12, 1992·44 cites·12 claims
- 0962US5221421AControlled etching process for forming fine-geometry circuit lines on a substrateHEWLETT PACKARD CO·Filed 1992·Granted Jun 22, 1993·35 cites·26 claims
- 1050US5268048AReworkable die attachmentHEWLETT PACKARD CO·Filed 1992·Granted Dec 7, 1993·22 cites·2 claims
- 1129US5749988AReworkable die attachment to heat spreaderFiled 1994·Granted May 12, 1998·7 cites·16 claims
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