Inventor

IYER RAVI

US140 patents

⚠️ This page may combine multiple inventors who share the name “IYER RAVI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IYER RAVI

MICRON TECHNOLOGY INC

Reactive sputter faceting of silicon dioxide to enhance gap fill of spaces between metal lines

Planarization using plasma oxidized amorphous silicon

Local interconnect comprising titanium nitride barrier layer

Apparatus and method to increase gas residence time in a reactor

Method for depositing a tungsten layer on silicon

Endpoint regulator and method for regulating a change in wafer thickness in chemical-mechanical planarization of semiconductor wafers

Methods of forming devices associated with semiconductor constructions

Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants

Method of making a void-free aluminum film

Method of making a void-free aluminum film

Method to clean substrate and improve photoresist profile

Insulating materials

Method of forming materials between conductive electrical components, and insulating materials

Semiconductor processing methods

Isolation using an antireflective coating

Titanium boride gate electrode and interconnect and methods regarding same

Techniques for improving adhesion of silicon dioxide to titanium

Isolation using an antireflective coating

Method of forming a local interconnect including selectively etched conductive layers and recess formation

Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants

Depletion compensated polysilicon electrodes

Integrated circuitry

Aluminum film for semiconductive devices

Method for passivating the sidewalls of a tungsten word line

Method for trench isolation by selective deposition of low temperature oxide films

Method of depositing a smooth conformal aluminum film on a refractory metal nitride layer

Transistor structures

Methods of forming materials between conductive electrical components, and insulating materials

Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants

Titanium boride gate electrode and interconnect and methods regarding same

Titanium boride gate electrode and interconnect

Isolation using an antireflective coating

Isolation using an antireflective coating

Method of depositing silicon oxides

Method for improving thickness uniformity of deposited ozone-TEOS silicate glass layers

Process of forming metal silicide interconnects

Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants

Method of inhibiting deposition of material on an internal wall of a chemical vapor deposition reactor

Method for improving thickness uniformity of deposited ozone-TEOS silicate glass layers

Process of forming metal silicide interconnects

Method of reducing carbon incorporation into films produced by chemical vapor deposition involving organometallic precursor compounds

Method of depositing silicon oxides

Method of forming aluminum film

Method of depositing passivation layers on semiconductor device arrays

Apparatus to increase gas residence time in a reactor

Method of inhibiting deposition of material on an internal wall of a chemical vapor deposition reactor

Method for forming fluorine-doped glass having low concentrations of free fluorine

SPLUNK INC

User activity monitoring

MICRON SEMICONDUCTOR INC

Method of depositing SiO2 on a semiconductor substrate

INTEL CORP

Packet coalescing