Inventor · disambiguated record
Minoru Egusa
Also filed as: EGUSA MINORU
6 granted patents·5 citations·filing 2014–2020
70Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP6
Top patents by PatentIndex Score
6 records- 0173US9640453B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted May 2, 2017·4 cites·17 claims
- 0262US9979105B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted May 22, 2018·1 cites·8 claims
- 0345US11742251B2Power semiconductor device including press-fit connection terminalMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 29, 2023·0 cites·11 claims
- 0444US9887142B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Feb 6, 2018·0 cites·13 claims
- 0540US10388581B2Semiconductor device having press-fit terminals disposed in recesses in a case frameMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Aug 20, 2019·0 cites·6 claims
- 0634US11631653B2Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication methodMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 18, 2023·0 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →