Inventor · disambiguated record
Hidetoshi Ishibashi
Also filed as: ISHIBASHI HIDETOSHI
19 granted patents·5 pending applications·15 citations·filing 2009–2024
89Inventor score
Files withMITSUBISHI ELECTRIC CORP20VICTOR COMPANY OF JAPAN2SAKAMOTO MICHITAKA1VICTOR COMPANY OF JAPAN LTD A CORP OF JAPAN1
Top patents by PatentIndex Score
24 records- 0177US11424178B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 23, 2022·1 cites·8 claims
- 0275US8339536B2Display module, display-module support structure and liquid crystal display apparatusSAKAMOTO MICHITAKA·Filed 2010·Granted Dec 25, 2012·5 cites·7 claims
- 0373US9583407B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Feb 28, 2017·2 cites·8 claims
- 0472US9484294B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Nov 1, 2016·2 cites·9 claims
- 0568US10770367B2Semiconductor apparatus, method for manufacturing the same and electric power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 8, 2020·1 cites·13 claims
- 0668US10026670B1Power moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 17, 2018·1 cites·5 claims
- 0767US10790218B2Semiconductor device and electric power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Sep 29, 2020·1 cites·8 claims
- 0862US11270982B2Method of manufacturing power semiconductor device and power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 8, 2022·1 cites·7 claims
- 0962US9979105B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted May 22, 2018·1 cites·8 claims
- 1059US2024282664A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1155US12352674B2Test method and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Jul 8, 2025·0 cites·10 claims
- 1252US11107760B2Semiconductor device, electric power conversion apparatus and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Aug 31, 2021·0 cites·10 claims
- 1350US12125758B2Power semiconductor device and method of manufacturing the same, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Oct 22, 2024·0 cites·13 claims
- 1446US11329012B2Semiconductor device having a conductive film on an inner wall of a through holeMITSUBISHI ELECTRIC CORP·Filed 2019·Granted May 10, 2022·0 cites·12 claims
- 1545US11742251B2Power semiconductor device including press-fit connection terminalMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 29, 2023·0 cites·11 claims
- 1645US11404340B2Semiconductor device and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Aug 2, 2022·0 cites·9 claims
- 1745US2011049000A1Package structure for thin display apparatus and method of packing thin display apparatusVICTOR COMPANY OF JAPAN·Filed 2010·Application pending·0 cites
- 1843US9735100B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Aug 15, 2017·0 cites·15 claims
- 1943US2015237718A1Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Application pending·0 cites
- 2041US2009225254A1Display module, display-module fixing structure and liquid crystal display apparatusVICTOR COMPANY OF JAPAN·Filed 2009·Application pending·0 cites
- 2140US10388581B2Semiconductor device having press-fit terminals disposed in recesses in a case frameMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Aug 20, 2019·0 cites·6 claims
- 2240US10068819B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 4, 2018·0 cites·9 claims
- 2338US10204886B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 12, 2019·0 cites·16 claims
- 2431US2010301714A1Cabinet and display apparatusVICTOR COMPANY OF JAPAN LTD A CORP OF JAPAN·Filed 2010·Application pending·0 cites
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