Inventor · disambiguated record
Cameron Mcknight-Macneil
Also filed as: MCKNIGHT-MACNEIL CAMERON
10 granted patents·1 pending application·70 citations·filing 2014–2022
87Inventor score
Top patents by PatentIndex Score
11 records- 0196US11342248B2Embedded die packaging for power semiconductor devicesGAN SYSTEMS INC·Filed 2020·Granted May 24, 2022·5 cites·35 claims
- 0296US9589868B2Packaging solutions for devices and systems comprising lateral GaN power transistorsGAN SYSTEMS INC·Filed 2016·Granted Mar 7, 2017·20 cites·19 claims
- 0394US9818692B2GaN semiconductor device structure and method of fabrication by substrate replacementGAN SYSTEMS INC·Filed 2016·Granted Nov 14, 2017·15 cites·19 claims
- 0493US11476188B2Fabrication of embedded die packaging comprising laser drilled viasGAN SYSTEMS INC·Filed 2020·Granted Oct 18, 2022·3 cites·18 claims
- 0593US9589869B2Packaging solutions for devices and systems comprising lateral GaN power transistorsGAN SYSTEMS INC·Filed 2016·Granted Mar 7, 2017·9 cites·21 claims
- 0689US9824949B2Packaging solutions for devices and systems comprising lateral GaN power transistorsGAN SYSTEMS INC·Filed 2016·Granted Nov 21, 2017·8 cites·21 claims
- 0785US9153509B2Fault tolerant design for large area nitride semiconductor devicesGAN SYSTEMS INC·Filed 2014·Granted Oct 6, 2015·9 cites·21 claims
- 0866US11776883B2Embedded die packaging for power semiconductor devicesGAN SYSTEMS INC·Filed 2022·Granted Oct 3, 2023·0 cites·18 claims
- 0965US9818857B2Fault tolerant design for large area nitride semiconductor devicesGAN SYSTEMS INC·Filed 2014·Granted Nov 14, 2017·1 cites·29 claims
- 1058US2023019052A1Fabrication of embedded die packaging comprising laser drilled viasGAN SYSTEMS INC·Filed 2022·Application pending·0 cites
- 1155US12166115B2Solder resist structure for embedded die packaging of power semiconductor devicesINFINEON TECH CANADA INC·Filed 2021·Granted Dec 10, 2024·0 cites·19 claims
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