Inventor · disambiguated record
Chang-Youl Moon
Also filed as: MOON CHANG-YOUL
47 granted patents·13 pending applications·366 citations·filing 1996–2015
98Inventor score
Top patents by PatentIndex Score
60 records- 0194US8107248B2Flexible device, flexible pressure sensorSHIN KYU-HO·Filed 2009·Granted Jan 31, 2012·39 cites·8 claims
- 0290US7821027B2LED package structure and manufacturing method, and LED array moduleSAMSUNG LED CO LTD·Filed 2006·Granted Oct 26, 2010·17 cites·23 claims
- 0390US7553047B2Lighting deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 30, 2009·51 cites·15 claims
- 0490US7417525B2High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductorSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 26, 2008·18 cites·16 claims
- 0589US9257508B2Transistors and methods of manufacturing the sameLEE CHANG-SEUNG·Filed 2012·Granted Feb 9, 2016·11 cites·41 claims
- 0689US7514718B2LED package, manufacturing method thereof, and LED array module using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 7, 2009·18 cites·20 claims
- 0788US8877572B2Graphene device manufacturing apparatus and graphene device manufacturing method using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 4, 2014·5 cites·27 claims
- 0888US7699442B2Piezoelectric inkjet printheadSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 20, 2010·8 cites·12 claims
- 0987US7263883B2Gyro-sensor comprising a plurality of component units, and fabricating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 4, 2007·15 cites·9 claims
- 1086US9000485B2Electrode structures, gallium nitride based semiconductor devices including the same and methods of manufacturing the sameLEE JEONG-YUB·Filed 2012·Granted Apr 7, 2015·9 cites·33 claims
- 1186US7755151B2Wafer level package for surface acoustic wave device and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 13, 2010·15 cites·11 claims
- 1285US9082844B2Methods of transferring semiconductor elements and manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 14, 2015·4 cites·18 claims
- 1384US7449366B2Wafer level packaging cap and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 11, 2008·12 cites·18 claims
- 1483US9056424B2Methods of transferring graphene and manufacturing device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 16, 2015·4 cites·20 claims
- 1580US7784177B2Method of manufacturing an image drumSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 31, 2010·6 cites·14 claims
- 1679US7335974B2Multi stack packaging chip and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 26, 2008·8 cites·16 claims
- 1779US6884650B2Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 26, 2005·31 cites·20 claims
- 1878US8999812B2Graphene devices and methods of manufacturing the sameXIANYU WENXU·Filed 2012·Granted Apr 7, 2015·4 cites·23 claims
- 1977US8680497B2Superhydrophobic electromagnetic field shielding material and method of preparing the sameCHO EUN-HYOUNG·Filed 2012·Granted Mar 25, 2014·3 cites·20 claims
- 2075US7489327B2Toner adsorption image forming apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 10, 2009·4 cites·15 claims
- 2174US9196478B2Graphene transferring methods, device manufacturing method using the same, and substrate structures including grapheneSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 24, 2015·1 cites·19 claims
- 2274US5669752ASemiconductor wafer pre-aligning apparatusSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Sep 23, 1997·43 cites·4 claims
- 2373US7928545B2LED package and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 19, 2011·5 cites·13 claims
- 2469US8042919B2Piezoelectric inkjet printheadSAMSUNG ELECTRO MECH·Filed 2010·Granted Oct 25, 2011·1 cites·15 claims
- 2567US8517249B2Soldering structure and method using ZnCHOI WON-KYOUNG·Filed 2007·Granted Aug 27, 2013·2 cites·7 claims
- 2666US9184052B2Semiconductor device and manufacturing method of semiconductor device using metal oxideSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 10, 2015·1 cites·15 claims
- 2766US8334585B2LED package and fabrication method thereofKWON KI-HWAN·Filed 2011·Granted Dec 18, 2012·2 cites·20 claims
- 2865US9006044B2Graphene device and method of manufacturing the sameLEE CHANG-SEUNG·Filed 2012·Granted Apr 14, 2015·1 cites·26 claims
- 2965US8002443B2LED array moduleSAMSUNG LED CO LTD·Filed 2006·Granted Aug 23, 2011·4 cites·6 claims
- 3063US9041999B2Electrowetting device and method of manufacturing the sameBAE KI-DEOK·Filed 2012·Granted May 26, 2015·2 cites·20 claims
- 3163US8162471B2Image forming element and manufacturing method thereofSHIN SU HO·Filed 2007·Granted Apr 24, 2012·2 cites·32 claims
- 3262US8921220B2Selective low-temperature ohmic contact formation method for group III-nitride heterojunction structured deviceWENXU XIANYU·Filed 2012·Granted Dec 30, 2014·1 cites·8 claims
- 3360US7781788B2Light emitting device package having a transparent coverSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 24, 2010·2 cites·18 claims
- 3455US6390581B1Ink jet printer headSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 21, 2002·7 cites·20 claims
- 3554US9029860B2Structure including gallium nitride substrate and method of manufacturing the gallium nitride substrateSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 12, 2015·0 cites·8 claims
- 3654US8002391B2Inkjet printhead having piezoelectric actuator and method of driving the piezoelectric actuatorSAMSUNG ELECTRO MECH·Filed 2010·Granted Aug 23, 2011·0 cites·3 claims
- 3754US7722166B2Inkjet printhead having piezoelectric actuator and method of driving the piezoelectric actuatorSAMSUNG ELECTRO MECH·Filed 2006·Granted May 25, 2010·0 cites·3 claims
- 3852US9515189B2Semiconductor device and manufacturing method of semiconductor device using metal oxideSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 6, 2016·0 cites·7 claims
- 3951US9337029B2Structure including gallium nitride substrate and method of manufacturing the gallium nitride substrateSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 10, 2016·0 cites·11 claims
- 4051US9293596B2Graphene devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 22, 2016·0 cites·11 claims
- 4150US2015144918A1Method of manufacturing optical film for reducing color shift, organic light-emitting display apparatus using optical film for reducing color shift, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 4248US8013349B2Light emitting device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 6, 2011·0 cites·9 claims
- 4347US2014299231A1Metal-based solder composite including conductive self-healing materialsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4446US2006056161A1Flexible device, flexible pressure sensor, and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4545US8592231B2LED package structure and manufacturing method, and LED array moduleSHIN SU-HO·Filed 2010·Granted Nov 26, 2013·0 cites·18 claims
- 4645US8269806B2Method of manufacturing image forming element, image forming element, and image forming apparatus having the sameKWON KI-HWAN·Filed 2008·Granted Sep 18, 2012·0 cites·11 claims
- 4744US7741774B2Backlight module including at least one luminescence element, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 22, 2010·0 cites·9 claims
- 4844US7452809B2Fabrication method of packaging substrate and packaging method using the packaging substrateSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 18, 2008·0 cites·12 claims
- 4943US2007194336A1Light emitting device package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 5042US2007024549A1Micro-mirror device package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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