Inventor · disambiguated record
Subhas Bothra
Also filed as: BOTHRA SUBHAS
90 granted patents·2 pending applications·3,276 citations·filing 1994–2011
99Inventor score
Files withVLSI TECHNOLOGY INC42PHILIPS ELECTRONICS NA24BROADCOM CORP6KONINKL PHILIPS ELECTRONICS NV6PHILIPS SEMICONDUCTORS INC3
Top patents by PatentIndex Score
92 records- 0196US6127811AMicro-electromechanical system and voltage shifter, method of synchronizing an electronic system and a micromechanical system of a micro-electromechanical systemVLSI TECHNOLOGY INC·Filed 1999·Granted Oct 3, 2000·183 cites·32 claims
- 0294US6492716B1Seal ring structure for IC containing integrated digital/RF/analog circuits and functionsZEEVO INC·Filed 2001·Granted Dec 10, 2002·125 cites·18 claims
- 0394US5916016AMethods and apparatus for polishing wafersVLSI TECHNOLOGY INC·Filed 1997·Granted Jun 29, 1999·120 cites·25 claims
- 0493US5798559AIntegrated circuit structure having an air dielectric and dielectric support pillarsVLSI TECHNOLOGY INC·Filed 1997·Granted Aug 25, 1998·133 cites·20 claims
- 0592US5854510ALow power programmable fuse structuresVLSI TECHNOLOGY INC·Filed 1997·Granted Dec 29, 1998·114 cites·24 claims
- 0691US5882998ALow power programmable fuse structures and methods for making the sameVLSI TECHNOLOGY INC·Filed 1998·Granted Mar 16, 1999·99 cites·14 claims
- 0789US6323113B1Intelligent gate-level fill methods for reducing global pattern density effectsPHILIPS ELECTRONICS NA·Filed 1999·Granted Nov 27, 2001·106 cites·34 claims
- 0889US6214734B1Method of using films having optimized optical properties for chemical mechanical polishing endpoint detectionVLSI TECHNOLOGY INC·Filed 1998·Granted Apr 10, 2001·87 cites·26 claims
- 0988US8270629B2System and method allowing for safe use of a headsetBOTHRA SUBHAS·Filed 2005·Granted Sep 18, 2012·29 cites·24 claims
- 1088US6020616AAutomated design of on-chip capacitive structures for suppressing inductive noiseVLSI TECHNOLOGY INC·Filed 1998·Granted Feb 1, 2000·103 cites·21 claims
- 1187US7489221B2Fully differential, high Q, on-chip, impedance matching sectionBROADCOM CORP·Filed 2006·Granted Feb 10, 2009·11 cites·15 claims
- 1287US6710425B2Structure to increase density of MIM capacitors between adjacent metal layers in an integrated circuitZEEVO INC·Filed 2001·Granted Mar 23, 2004·47 cites·8 claims
- 1387US6057224AMethods for making semiconductor devices having air dielectric interconnect structuresVLSI TECHNOLOGY INC·Filed 1997·Granted May 2, 2000·84 cites·28 claims
- 1487US5639697ADummy underlayers for improvement in removal rate consistency during chemical mechanical polishingVLSI TECHNOLOGY INC·Filed 1996·Granted Jun 17, 1997·73 cites·8 claims
- 1587US5597668APatterned filled photo mask generation for integrated circuit manufacturingVLSI TECHNOLOGY INC·Filed 1995·Granted Jan 28, 1997·88 cites·18 claims
- 1686US6573148B1Methods for making semiconductor inductorKONINKLLJKE PHILIPS ELECTRONIC·Filed 2000·Granted Jun 3, 2003·42 cites·14 claims
- 1786US6143642AProgrammable semiconductor structures and methods for making the sameVLSI TECHNOLOGY INC·Filed 1997·Granted Nov 7, 2000·85 cites·21 claims
- 1885US6569757B1Methods for forming co-axial interconnect lines in a CMOS process for high speed applicationsPHILIPS ELECTRONICS NA·Filed 1999·Granted May 27, 2003·74 cites·18 claims
- 1985US6189136B1Design level optical proximity correction methodsPHILIPS ELECTRONICS NA·Filed 1998·Granted Feb 13, 2001·55 cites·20 claims
- 2085US5915203AMethod for producing deep submicron interconnect viasVLSI TECHNOLOGY INC·Filed 1997·Granted Jun 22, 1999·80 cites·11 claims
- 2182US6281585B1Air gap dielectric in self-aligned via structuresPHILIPS ELECTRONICS NA·Filed 1999·Granted Aug 28, 2001·64 cites·13 claims
- 2282US6030885AHexagonal semiconductor die, semiconductor substrates, and methods of forming a semiconductor dieVLSI TECHNOLOGY INC·Filed 1997·Granted Feb 29, 2000·61 cites·18 claims
- 2381US6545338B1Methods for implementing co-axial interconnect lines in a CMOS process for high speed RF and microwave applicationsKONINKL PHILIPS ELECTRONICS NV·Filed 1999·Granted Apr 8, 2003·63 cites·5 claims
- 2479US6313466B1Method for determining nitrogen concentration in a film of nitrided oxide materialPHILIPS ELECTRONICS NA·Filed 1999·Granted Nov 6, 2001·52 cites·22 claims
- 2579US5540958AMethod of making microscope probe tipsVLSI TECHNOLOGY INC·Filed 1994·Granted Jul 30, 1996·42 cites·18 claims
- 2678US7095307B1Fully differential, high Q, on-chip, impedance matching sectionBROADCOM CORP·Filed 2003·Granted Aug 22, 2006·20 cites·7 claims
- 2778US6387720B1Waveguide structures integrated with standard CMOS circuitry and methods for making the samePHILLIPS ELECTRONICS NORTH AME·Filed 1999·Granted May 14, 2002·51 cites·15 claims
- 2878US5834356AMethod of making high resistive structures in salicided process semiconductor devicesVLSI TECHNOLOGY INC·Filed 1997·Granted Nov 10, 1998·42 cites·21 claims
- 2977US7614024B2Method to implement metal fill during integrated circuit design and layoutBROADCOM CORP·Filed 2005·Granted Nov 3, 2009·8 cites·17 claims
- 3076US6275971B1Methods and apparatus for design rule checkingPHILIPS ELECTRONICS NA·Filed 1997·Granted Aug 14, 2001·76 cites·22 claims
- 3175US7434189B2I/O driver power distribution method for reducing silicon areaBROADCOM CORP·Filed 2005·Granted Oct 7, 2008·7 cites·18 claims
- 3275US6129613ASemiconductor manufacturing apparatus and method for measuring in-situ pressure across a waferPHILIPS ELECTRONICS NA·Filed 1998·Granted Oct 10, 2000·34 cites·3 claims
- 3372US6297557B1Reliable aluminum interconnect via structuresPHILIPS ELECTRONICS NA·Filed 1998·Granted Oct 2, 2001·32 cites·4 claims
- 3472US5981378AReliable interconnect via structures and methods for making the sameVLSI TECHNOLOGY INC·Filed 1997·Granted Nov 9, 1999·32 cites·7 claims
- 3571US6717232B2Semiconductor inductor and methods for making the sameKONINKL PHILIPS ELECTRONICS NV·Filed 2003·Granted Apr 6, 2004·13 cites·5 claims
- 3671US6327695B1Automated design of on-chip capacitive structures for suppressing inductive noisePHILIPS ELECTRONICS NA·Filed 1999·Granted Dec 4, 2001·34 cites·15 claims
- 3771US6277708B1Semiconductor structures for suppressing gate oxide plasma charging damage and methods for making the samePHILIPS ELECTRONICS NA·Filed 1999·Granted Aug 21, 2001·33 cites·7 claims
- 3870US6133111AMethod of making photo alignment structurePHILIPS ELECTRONICS NA·Filed 1998·Granted Oct 17, 2000·33 cites·18 claims
- 3969US6013927ASemiconductor structures for suppressing gate oxide plasma charging damage and methods for making the sameVLSI TECHNOLOGY INC·Filed 1998·Granted Jan 11, 2000·30 cites·17 claims
- 4068US6191481B1Electromigration impeding composite metallization lines and methods for making the samePHILIPS ELECTRONICS NA·Filed 1998·Granted Feb 20, 2001·38 cites·15 claims
- 4168US5913141AReliable interconnect via structures and methods for making the sameVLSI TECHNOLOGY INC·Filed 1998·Granted Jun 15, 1999·27 cites·21 claims
- 4267US6303192B1Process to improve adhesion of PECVD cap layers in integrated circuitsPHILIPS SEMICONDUCTOR INC·Filed 1998·Granted Oct 16, 2001·33 cites·20 claims
- 4366US7911310B2Fully differential, high Q, on-chip, impedance matching sectionBROADCOM CORP·Filed 2009·Granted Mar 22, 2011·2 cites·39 claims
- 4466US6176983B1Methods of forming a semiconductor deviceVLSI TECHNOLOGY INC·Filed 1997·Granted Jan 23, 2001·32 cites·24 claims
- 4565US6133635AProcess for making self-aligned conductive via structuresPHILIPS ELECTRONICS NA·Filed 1997·Granted Oct 17, 2000·32 cites·16 claims
- 4665US5985749AMethod of forming a via hole structure including CVD tungsten silicide barrier layerVLSI TECHNOLOGY INC·Filed 1997·Granted Nov 16, 1999·31 cites·11 claims
- 4765US5963784AMethods of determining parameters of a semiconductor device and the width of an insulative spacer of a semiconductor deviceVLSI TECHNOLOGY INC·Filed 1997·Granted Oct 5, 1999·30 cites·53 claims
- 4864US6013536AApparatus for automated pillar layout and method for implementing sameVLSI TECHNOLOGY INC·Filed 1997·Granted Jan 11, 2000·26 cites·18 claims
- 4963US5928968ASemiconductor pressure transducer structures and methods for making the sameVLSI TECHNOLOGY INC·Filed 1997·Granted Jul 27, 1999·20 cites·9 claims
- 5062US6221759B1Method for forming aligned vias under trenches in a dual damascene processPHILIPS ELECTRONICS NA·Filed 1998·Granted Apr 24, 2001·29 cites·46 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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