Inventor · disambiguated record
Warren D. Dyckman
Also filed as: DYCKMAN WARREN D
9 granted patents·1 pending application·246 citations·filing 2002–2010
90Inventor score
Top patents by PatentIndex Score
10 records- 0194US7617403B2Method and apparatus for controlling heat generation in a multi-core processorIBM·Filed 2006·Granted Nov 10, 2009·37 cites·17 claims
- 0292US8214660B2Structure for an apparatus for monitoring and controlling heat generation in a multi-core processorCAPPS JR LOUIS BENNIE·Filed 2008·Granted Jul 3, 2012·49 cites·15 claims
- 0391US7584369B2Method and apparatus for monitoring and controlling heat generation in a multi-core processorIBM·Filed 2006·Granted Sep 1, 2009·28 cites·15 claims
- 0487US7721119B2System and method to optimize multi-core microprocessor performance using voltage offsetsIBM·Filed 2006·Granted May 18, 2010·20 cites·30 claims
- 0587US6657864B1High density thermal solution for direct attach modulesIBM·Filed 2002·Granted Dec 2, 2003·52 cites·17 claims
- 0684US7085143B1In-module current sourceIBM·Filed 2005·Granted Aug 1, 2006·13 cites·20 claims
- 0781US7271681B2Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boardsIBM·Filed 2005·Granted Sep 18, 2007·12 cites·11 claims
- 0881US6680530B1Multi-step transmission line for multilayer packagingIBM·Filed 2002·Granted Jan 20, 2004·33 cites·23 claims
- 0941US6583498B1Integrated circuit packaging with tapered striplines of constant impedanceIBM·Filed 2002·Granted Jun 24, 2003·2 cites·12 claims
- 1037US2011206379A1Opto-electronic module with improved low power, high speed electrical signal integrityIBM·Filed 2010·Application pending·0 cites
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