Inventor · disambiguated record
Peter J. Sorce
Also filed as: SORCE PETER · SORCE PETER J · SORCE PETER JEROME
17 granted patents·1 pending application·279 citations·filing 1991–2020
93Inventor score
Top patents by PatentIndex Score
18 records- 0194US9472859B2Integration of area efficient antennas for phased array or wafer scale array antenna applicationsIBM·Filed 2014·Granted Oct 18, 2016·16 cites·12 claims
- 0294US5231751AProcess for thin film interconnectIBM·Filed 1991·Granted Aug 3, 1993·166 cites·34 claims
- 0392US10879202B1System and method for forming solder bumpsIBM·Filed 2019·Granted Dec 29, 2020·6 cites·15 claims
- 0491US10103450B2Integration of area efficient antennas for phased array or wafer scale array antenna applicationsIBM·Filed 2016·Granted Oct 16, 2018·7 cites·20 claims
- 0589US8419895B2Laser ablation for integrated circuit fabricationDANG BING·Filed 2010·Granted Apr 16, 2013·11 cites·20 claims
- 0687US10168478B2Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technologyIBM·Filed 2017·Granted Jan 1, 2019·4 cites·20 claims
- 0782US9632251B2Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technologyIBM·Filed 2014·Granted Apr 25, 2017·4 cites·12 claims
- 0873US6228511B1Structure and process for thin film interconnectIBM·Filed 1999·Granted May 8, 2001·38 cites·9 claims
- 0967US11990437B2System and method for forming solder bumpsIBM·Filed 2020·Granted May 21, 2024·0 cites·14 claims
- 1064US6165629AStructure for thin film interconnectIBM·Filed 1993·Granted Dec 26, 2000·27 cites·25 claims
- 1157US10535592B2Method for forming solder bumps using sacrificial layerIBM·Filed 2018·Granted Jan 14, 2020·0 cites·17 claims
- 1256US9433101B2Substrate via fillingIBM·Filed 2014·Granted Aug 30, 2016·0 cites·1 claims
- 1355US10168477B2Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technologyIBM·Filed 2016·Granted Jan 1, 2019·0 cites·20 claims
- 1452US9872394B2Substrate via fillingIBM·Filed 2016·Granted Jan 16, 2018·0 cites·18 claims
- 1549US9953908B2Method for forming solder bumps using sacrificial layerIBM·Filed 2015·Granted Apr 24, 2018·0 cites·8 claims
- 1647US2022157657A1Singulating individual chips from wafers having small chips and small separation channelsIBM·Filed 2020·Application pending·0 cites
- 1746US9171742B2Alignment of integrated circuit chip stackIBM·Filed 2013·Granted Oct 27, 2015·0 cites·20 claims
- 1838US8388782B2Handler attachment for integrated circuit fabricationANDRY PAUL S·Filed 2010·Granted Mar 5, 2013·0 cites·10 claims
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