Inventor · disambiguated record
Shaji Farooq
Also filed as: FAROOQ SHAJI
40 granted patents·1,586 citations·filing 1991–2003
98Inventor score
Files withIBM40
Top patents by PatentIndex Score
40 records- 0198US6528145B1Polymer and ceramic composite electronic substratesIBM·Filed 2000·Granted Mar 4, 2003·208 cites·30 claims
- 0297US6444496B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 2000·Granted Sep 3, 2002·123 cites·10 claims
- 0394US6333563B1Electrical interconnection package and method thereofIBM·Filed 2000·Granted Dec 25, 2001·85 cites·21 claims
- 0493US6283359B1Method for enhancing fatigue life of ball grid arraysIBM·Filed 2000·Granted Sep 4, 2001·53 cites·5 claims
- 0591US6023407AStructure for a thin film multilayer capacitorIBM·Filed 1998·Granted Feb 8, 2000·80 cites·26 claims
- 0690US6275381B1Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereofIBM·Filed 1998·Granted Aug 14, 2001·65 cites·12 claims
- 0788US6184062B1Process for forming cone shaped solder for chip interconnectionIBM·Filed 1999·Granted Feb 6, 2001·56 cites·71 claims
- 0887US6300164B1Structure, materials, and methods for socketable ball gridIBM·Filed 2000·Granted Oct 9, 2001·42 cites·16 claims
- 0986US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 1085US6559527B2Process for forming cone shaped solder for chip interconnectionIBM·Filed 2001·Granted May 6, 2003·28 cites·20 claims
- 1184US6297559B1Structure, materials, and applications of ball grid array interconnectionsIBM·Filed 1998·Granted Oct 2, 2001·55 cites·42 claims
- 1284US6235996B1Interconnection structure and process module assembly and reworkIBM·Filed 1998·Granted May 22, 2001·65 cites·35 claims
- 1382US6158644AMethod for enhancing fatigue life of ball grid arraysIBM·Filed 1998·Granted Dec 12, 2000·43 cites·9 claims
- 1482US5541005ALarge ceramic article and method of manufacturingIBM·Filed 1995·Granted Jul 30, 1996·64 cites·19 claims
- 1581US5968670AEnhanced ceramic ball grid array using in-situ solder stretch with springIBM·Filed 1997·Granted Oct 19, 1999·63 cites·17 claims
- 1679US6216324B1Method for a thin film multilayer capacitorIBM·Filed 1999·Granted Apr 17, 2001·37 cites·36 claims
- 1774US6574859B2Interconnection process for module assembly and reworkIBM·Filed 2001·Granted Jun 10, 2003·18 cites·25 claims
- 1874US6124041ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1999·Granted Sep 26, 2000·35 cites·10 claims
- 1974US5964396AEnhanced ceramic ball grid array using in-situ solder stretch with clipIBM·Filed 1997·Granted Oct 12, 1999·36 cites·15 claims
- 2074US5284286APorous metal block for removing solder or braze from a substate and a process for making the sameIBM·Filed 1991·Granted Feb 8, 1994·31 cites·9 claims
- 2171US5073180AMethod for forming sealed co-fired glass ceramic structuresIBM·Filed 1991·Granted Dec 17, 1991·42 cites·60 claims
- 2269US5337475AProcess for producing ceramic circuit structures having conductive viasIBM·Filed 1992·Granted Aug 16, 1994·37 cites·16 claims
- 2368US5975409ACeramic ball grid array using in-situ solder stretchIBM·Filed 1997·Granted Nov 2, 1999·36 cites·5 claims
- 2467US5219520AProcess of making a porous metal block for removing solder or brazeIBM·Filed 1992·Granted Jun 15, 1993·24 cites·28 claims
- 2566US6984792B2Dielectric interposer for chip to substrate solderingIBM·Filed 2003·Granted Jan 10, 2006·9 cites·14 claims
- 2664US6461493B1Decoupling capacitor method and structure using metal based carrierIBM·Filed 1999·Granted Oct 8, 2002·23 cites·20 claims
- 2764US6120885AStructure, materials, and methods for socketable ball gridIBM·Filed 1998·Granted Sep 19, 2000·25 cites·18 claims
- 2863US5787578AMethod of selectively depositing a metallic layer on a ceramic substrateIBM·Filed 1996·Granted Aug 4, 1998·31 cites·19 claims
- 2957US6271111B1High density pluggable connector array and process thereofIBM·Filed 1998·Granted Aug 7, 2001·19 cites·8 claims
- 3050US5925443ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1991·Granted Jul 20, 1999·14 cites·5 claims
- 3149US5532031AI/O pad adhesion layer for a ceramic substrateIBM·Filed 1992·Granted Jul 2, 1996·17 cites·14 claims
- 3244US5961032AMethod of fabrication of a multi-component solder column by blocking a portion of a through hole in a moldIBM·Filed 1997·Granted Oct 5, 1999·12 cites·6 claims
- 3340US5525761ACopper-based paste containing refractory metal additions for densification controlIBM·Filed 1995·Granted Jun 11, 1996·7 cites·6 claims
- 3439US5935404AMethod of performing processes on features with electricityIBM·Filed 1997·Granted Aug 10, 1999·7 cites·10 claims
- 3536US5512711ACopper-based paste containing refractory metal additions for densification controlIBM·Filed 1994·Granted Apr 30, 1996·6 cites·14 claims
- 3632US5985128AMethod of performing processes on features with electricityIBM·Filed 1999·Granted Nov 16, 1999·2 cites·10 claims
- 3732US5977625ASemiconductor package with low strain sealIBM·Filed 1997·Granted Nov 2, 1999·2 cites·12 claims
- 3831US5723905ASemiconductor package with low strain sealIBM·Filed 1995·Granted Mar 3, 1998·1 cites·2 claims
- 3931US5439636ALarge ceramic articles and method of manufacturingIBM·Filed 1992·Granted Aug 8, 1995·4 cites·26 claims
- 4030US6358439B1Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1995·Granted Mar 19, 2002·1 cites·5 claims
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