Inventor · disambiguated record
Chia-Yu Jin
Also filed as: JIN CHIA-YU
4 granted patents·2 pending applications·7 citations·filing 2010–2024
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0194US12095142B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2022·Granted Sep 17, 2024·2 cites·13 claims
- 0278US10515887B2Fan-out package structure having stacked carrier substrates and method for forming the sameMEDIATEK INC·Filed 2017·Granted Dec 24, 2019·3 cites·23 claims
- 0378US2025015483A1Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0468US11509038B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 0559US2024371781A1Electronic deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0656US8404501B2Semiconductor package structure and manufacturing method thereofHUANG PO-YAO·Filed 2010·Granted Mar 26, 2013·2 cites·34 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →