Inventor · disambiguated record
Chun-Yen Lo
Also filed as: LO CHUN-YEN
13 granted patents·6 pending applications·57 citations·filing 2003–2025
88Inventor score
Top patents by PatentIndex Score
19 records- 0192US11908843B2Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·20 claims
- 0287US10535554B2Semiconductor die having edge with multiple gradients and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·3 cites·20 claims
- 0386US2025329695A1Semiconductor package and method of bonding workpiecesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0486US2025336899A1Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0583US2024363398A1Semiconductor die having edge with multiple gradientsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0682US12406970B2Semiconductor package and method of bonding workpiecesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 0782US12381191B2Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 0880US7122458B2Method for fabricating pad redistribution layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 17, 2006·35 cites·17 claims
- 0977US11211318B2Bump layout for coplanarity improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·3 cites·19 claims
- 1074US10741513B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·1 cites·20 claims
- 1173US12087618B2Method for forming semiconductor die having edge with multiple gradientsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 1270US11004728B2Semiconductor die having edge with multiple gradients and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 11, 2021·0 cites·20 claims
- 1369US11527504B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 1463US7187078B2Bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 6, 2007·13 cites·21 claims
- 1557US10163836B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·0 cites·20 claims
- 1653US9875979B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 23, 2018·0 cites·22 claims
- 1739US2008251916A1UBM structure for strengthening solder bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 1839US2013032837A1Fluorescent Coating and a Method for Making the SameCHUNG SHAN INST OF SCIENCE·Filed 2011·Application pending·0 cites
- 1935US2005130437A1Dry film remove pre-filter systemTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →