Inventor · disambiguated record
Xiao Lu
Also filed as: LU XIAO · LU XIAO-FENG
8 granted patents·15 pending applications·47 citations·filing 2012–2024
83Inventor score
Top patents by PatentIndex Score
23 records- 0194US9957609B2Process for making of glass articles with optical and easy-to-clean coatingsCORNING INC·Filed 2013·Granted May 1, 2018·20 cites·13 claims
- 0294US8817376B2Optical coating method, apparatus and productCORNING INC·Filed 2013·Granted Aug 26, 2014·14 cites·13 claims
- 0385US9013795B2Optical coating method, apparatus and productCORNING INC·Filed 2014·Granted Apr 21, 2015·6 cites·25 claims
- 0484US10077207B2Optical coating method, apparatus and productCORNING INC·Filed 2013·Granted Sep 18, 2018·7 cites·8 claims
- 0568US2024162134A1Varied ball ball-grid-array (bga) packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0668US2025128362A1Micrometer metal particle reinforced tin-bismuth low temperature solder materialsINTEL CORP·Filed 2023·Application pending·0 cites
- 0764US11208717B2Process for making of glass articles with optical and easy-to-clean coatingsCORNING INC·Filed 2018·Granted Dec 28, 2021·0 cites·15 claims
- 0862US11180410B2Optical coating method, apparatus and productCORNING INC·Filed 2018·Granted Nov 23, 2021·0 cites·24 claims
- 0959US2025218992A1Core-shell ball grid array materials for large form factor integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1055US11916003B2Varied ball ball-grid-array (BGA) packagesINTEL CORP·Filed 2019·Granted Feb 27, 2024·0 cites·22 claims
- 1155US2023415253A1Liquid metal (lm) dispensing apparatus and methods for design and operation of sameINTEL CORP·Filed 2022·Application pending·0 cites
- 1252US2025357236A1Bilayer encapsulation structure for liquid metal interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 1352US2025112190A1Self-diffusing liquid metal interconnect architectures enabling snap-on room temperature assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 1451US2013135741A1Optical coating method, apparatus and productLEE CHRISTOPHER MORTON·Filed 2012·Application pending·0 cites
- 1551US2023317619A1Microelectronic structure including die bonding film between embedded die and surface of substrate cavity, and method of making sameINTEL CORP·Filed 2022·Application pending·0 cites
- 1650US2025106994A1Three ball second level interconnect package architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 1749US2025112106A1Flexible thermal interposer for backside cooling of double-sided packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1846US2024304506A1Integrated antioxidant and sealant solution to address temperature humidity reliability issue of liquid metal interconnectINTEL CORP·Filed 2023·Application pending·0 cites
- 1946US2023299024A1Bumping for liquid metal socket interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 2044US2023317476A1Direct injection filling device, system, and method for liquid metal interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 2142US2014113083A1Process for making of glass articles with optical and easy-to-clean coatingsCORNING INC·Filed 2012·Application pending·0 cites
- 2240US2021048807A1Method of modeling multi-mode degradation process and predicting remaining useful lifeUNIV SHANDONG SCIENCE & TECH·Filed 2018·Application pending·0 cites
- 2337US10278318B2Method of assembling an electronic component using a probe having a fluid thereonINTEL CORP·Filed 2015·Granted Apr 30, 2019·0 cites·16 claims
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