Inventor · disambiguated record
Hirofumi Kurosawa
Also filed as: KUROSAWA HIROFUMI
9 granted patents·4 pending applications·69 citations·filing 1998–2023
85Inventor score
Files withSEIKO EPSON CORP12
Top patents by PatentIndex Score
13 records- 0187US7285305B2Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatusSEIKO EPSON CORP·Filed 2003·Granted Oct 23, 2007·37 cites·6 claims
- 0274US7692847B2Electrophoresis display and electronic apparatus including an electrophoresis displaySEIKO EPSON CORP·Filed 2008·Granted Apr 6, 2010·4 cites·10 claims
- 0372US7454831B2Method for mounting an electronic element on a wiring boardSEIKO EPSON CORP·Filed 2005·Granted Nov 25, 2008·8 cites·8 claims
- 0463US7135975B2Contactless data communication system, countactless identification tag and contactless identification tag control programSEIKO EPSON CORP·Filed 2004·Granted Nov 14, 2006·12 cites·13 claims
- 0562US2023297031A1Timepiece Component Decoration Method And Timepiece ComponentSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0658US7538677B2Contactless data communication system, contactless identification tag and contactless identification tag control programSEIKO EPSON CORP·Filed 2006·Granted May 26, 2009·1 cites·6 claims
- 0753US2023297032A1Dial Decoration Method And DialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0851US2007094870A1Wiring board, method of manufacturing the same, semiconductor device, and electronic instrumentSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 0946US7189598B2Wiring board, method of manufacturing the same, semiconductor device, and electronic instrumentSEIKO EPSON CORP·Filed 2004·Granted Mar 13, 2007·2 cites·2 claims
- 1042US2004237296A1Wiring board, method of manufacturing the same, semiconductor device, and electronic instrumentFiled 2004·Application pending·0 cites
- 1140US7964955B2Electronic device package and electronic equipmentSEIKO EPSON CORP·Filed 2005·Granted Jun 21, 2011·0 cites·7 claims
- 1238US7226520B2Method for forming pattern and method for forming multilayer wiring structure by droplet discharge systemSEIKO EPSON CORP·Filed 2004·Granted Jun 5, 2007·0 cites·13 claims
- 1336US6635896B1Optical disk stamper examination machine, optical disk stamper examination method, and optical disk stamperSEIKO EPSON CORP·Filed 1998·Granted Oct 21, 2003·5 cites·19 claims
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