Inventor · disambiguated record
Martin Goetz
Also filed as: GOETZ MARTIN · GOETZ MARTIN P
23 granted patents·6 pending applications·665 citations·filing 1993–2012
97Inventor score
Top patents by PatentIndex Score
29 records- 0193US6175161B1System and method for packaging integrated circuitsALPINE MICROSYSTEMS INC·Filed 1998·Granted Jan 16, 2001·108 cites·20 claims
- 0291US6649446B1Hermetic package for multiple contact-sensitive electronic devices and methods of manufacturing thereofCLARISAY INC·Filed 2001·Granted Nov 18, 2003·78 cites·18 claims
- 0389US6300161B1Module and method for interconnecting integrated circuits that facilitates high speed signal propagation with reduced noiseALPINE MICROSYSTEMS INC·Filed 2000·Granted Oct 9, 2001·58 cites·15 claims
- 0484US6650205B2Wafer-scale package for surface acoustic wave circuit and method of manufacturing the sameCLARISAY INC·Filed 2001·Granted Nov 18, 2003·31 cites·14 claims
- 0584US6507097B1Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the sameCLARISAY INC·Filed 2001·Granted Jan 14, 2003·28 cites·21 claims
- 0684US5736783AHigh frequency microelectronics packageSTRATEDGE CORP·Filed 1996·Granted Apr 7, 1998·89 cites·20 claims
- 0783US6495398B1Wafer-scale package for surface acoustic wave circuit and method of manufacturing the sameCLARISAY INC·Filed 2001·Granted Dec 17, 2002·24 cites·20 claims
- 0882US6621379B1Hermetic package for surface acoustic wave device and method of manufacturing the sameCLARISAY INC·Filed 2001·Granted Sep 16, 2003·24 cites·29 claims
- 0981US5692298AMethod of making ceramic microwave electronic packageSTRATEDGE CORP·Filed 1995·Granted Dec 2, 1997·54 cites·20 claims
- 1077US8767411B2Electronic device with aerogel thermal isolationGOETZ MARTIN P·Filed 2012·Granted Jul 1, 2014·4 cites·14 claims
- 1174US7665196B2Method for forming a multi-frequency surface acoustic wave deviceLEE DAVID M·Filed 2007·Granted Feb 23, 2010·7 cites·8 claims
- 1272US7671984B2Spectrometric measuring probe and method for recalibrating the sameZEISS CARL MICROIMAGING GMBH·Filed 2005·Granted Mar 2, 2010·4 cites·21 claims
- 1372US6436735B1Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contactALPINE MICROSYSTEMS INC·Filed 2000·Granted Aug 20, 2002·16 cites·20 claims
- 1468US5465008ACeramic microelectronics packageSTRATEDGE CORP·Filed 1993·Granted Nov 7, 1995·32 cites·19 claims
- 1564US8806742B2Method of making an electronic packageCOHEN ERWIN B·Filed 2009·Granted Aug 19, 2014·3 cites·1 claims
- 1664US6639150B1Hermetic package for surface acoustic wave device having exposed device substrate contacts and method of manufacturing the sameCLARISAY INC·Filed 2002·Granted Oct 28, 2003·12 cites·32 claims
- 1763US6172412B1High frequency microelectronics packageSTRATEDGE CORP·Filed 1998·Granted Jan 9, 2001·31 cites·28 claims
- 1861US8231692B2Method for manufacturing an electronic deviceGOETZ MARTIN P·Filed 2008·Granted Jul 31, 2012·2 cites·6 claims
- 1961US6744336B1Wafer-scale package for surface acoustic wave circuit and method of manufacturing the sameCLARISAY INC·Filed 2002·Granted Jun 1, 2004·8 cites·20 claims
- 2060US5448826AMethod of making ceramic microwave electronic packageSTRATEDGE CORP·Filed 1994·Granted Sep 12, 1995·23 cites·11 claims
- 2157US5753972AMicroelectronics packageSTRATEDGE CORP·Filed 1996·Granted May 19, 1998·23 cites·21 claims
- 2243US7299528B2Method for forming a multi-frequency surface acoustic wave deviceLEE DAVID M·Filed 2002·Granted Nov 27, 2007·1 cites·7 claims
- 2342US2008061448A1System and method for thermal expansion pre-compensated package substrateIBM·Filed 2006·Application pending·0 cites
- 2441US2007210818A1Temperature monitoring and control apparatus and methodIBM·Filed 2006·Application pending·0 cites
- 2534US2001013650A1Circuit interconnect providing reduced crosstalk and simultaneous switching noiseFiled 2000·Application pending·0 cites
- 2632US6337576B1Wafer-level burn-inALPINE MICROSYSTEMS INC·Filed 1999·Granted Jan 8, 2002·5 cites·26 claims
- 2732US2003202180A1Optical measuring arrangement, in particular for quality control in continuous processesFiled 2003·Application pending·0 cites
- 2832US2002090095A1Module having integral surface acoustic wave circuits and method of manufacturing the sameFiled 2001·Application pending·0 cites
- 2930US2002001078A1Optical measuring arrangement, in particular for quality control in continuous processesFiled 2001·Application pending·0 cites
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