Inventor · disambiguated record
David A. Decrosta
Also filed as: DECROSTA DAVID A
12 granted patents·53 citations·filing 1992–2013
89Inventor score
Top patents by PatentIndex Score
12 records- 0174US8274160B2Active area bonding compatible high current structuresGASNER JOHN T·Filed 2010·Granted Sep 25, 2012·3 cites·22 claims
- 0268US7795130B2Active area bonding compatible high current structuresINTERSIL INC·Filed 2007·Granted Sep 14, 2010·3 cites·11 claims
- 0367US7224074B2Active area bonding compatible high current structuresINTERSIL INC·Filed 2005·Granted May 29, 2007·3 cites·57 claims
- 0460US7181306B2Enhanced plasma etch processINTERSIL INC·Filed 2004·Granted Feb 20, 2007·7 cites·19 claims
- 0560US7005369B2Active area bonding compatible high current structuresINTERSIL AMERICAN INC·Filed 2003·Granted Feb 28, 2006·8 cites·44 claims
- 0656US8946912B2Active area bonding compatible high current structuresINTERSIL INC·Filed 2013·Granted Feb 3, 2015·0 cites·15 claims
- 0754US8652960B2Active area bonding compatible high current structuresINTERSIL INC·Filed 2012·Granted Feb 18, 2014·0 cites·19 claims
- 0854US5808353ARadiation hardened dielectric for EEPROMHARRIS CORP·Filed 1996·Granted Sep 15, 1998·13 cites·15 claims
- 0951US8569896B2Active area bonding compatible high current structuresGASNER JOHN T·Filed 2012·Granted Oct 29, 2013·0 cites·19 claims
- 1039US6130172ARadiation hardened dielectric for EEPROMINTERSIL CORP·Filed 1998·Granted Oct 10, 2000·7 cites·12 claims
- 1132US5837603APlanarization method by use of particle dispersion and subsequent thermal flowHARRIS CORP·Filed 1996·Granted Nov 17, 1998·3 cites·23 claims
- 1231US5279850AGas phase chemical reduction of metallic branding layer of electronic circuit package for deposition of branding inkHARRIS CORP·Filed 1992·Granted Jan 18, 1994·6 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →